公开(公告)号：WO2012096678A3

公开(公告)日：2012-11-08

申请号：PCT/US2011022138

申请日：2011-01-21

Applicant: APPLIED MATERIALS INC ,  XU KUN ,  LIU FENG ,  BENVEGNU DOMINIC J ,  SWEDEK BOGUSLAW A ,  WANG YUCHUN ,  TU WEN-CHIANG ,  KARUPPIAH LAKSH

Inventor： XU KUN ,  LIU FENG ,  BENVEGNU DOMINIC J ,  SWEDEK BOGUSLAW A ,  WANG YUCHUN ,  TU WEN-CHIANG ,  KARUPPIAH LAKSH

IPC: H01L21/66 ,  H01L21/8247 ,  H01L27/115

CPC classification number: H01L22/26 ,  B24B37/005 ,  B24B37/013 ,  B24B49/12 ,  C01G9/00 ,  G01B11/0625 ,  G01B11/0683 ,  H01L21/30625 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/144 ,  H01L45/1683

Abstract: In polishing a substrate having a layer of GST disposed over an underlying layer, during polishing, a non-polarized light beam is directed onto the layer of GST. The non-polarized light beam reflects from the first substrate to generate a reflected light beam having an infra-red component. A sequence of measurements of intensity of the infra-red component of the reflected light beam are generated, and, in a processor, a time at which the sequence of measurements exhibits a predefined feature is determined.

Abstract translation: 在抛光具有设置在下层上的GST层的衬底时，在抛光期间，将非偏振光束引导到GST层上。 非偏振光束从第一基板反射以产生具有红外分量的反射光束。 生成反射光束的红外分量的强度的测量序列，并且在处理器中确定测量序列呈现预定特征的时间。

公开(公告)号：WO2012145336A2

公开(公告)日：2012-10-26

申请号：PCT/US2012/033969

申请日：2012-04-17

Applicant: APPLIED MATERIALS, INC. ,  DAVID, Jeffrey Drue ,  BENVEGNU, Dominic J. ,  SWEDEK, Boguslaw A. ,  LEE, Harry Q.

Inventor： DAVID, Jeffrey Drue ,  BENVEGNU, Dominic J. ,  SWEDEK, Boguslaw A. ,  LEE, Harry Q.

IPC: H01L21/304 ,  H01L21/66

CPC classification number: B24B49/12 ,  B24B37/013 ,  H01L22/12 ,  H01L22/26

Abstract: A method of controlling polishing includes polishing a substrate, monitoring a substrate during polishing with an in-situ monitoring system, generating a sequence of values from measurements from the in-situ monitoring system, fitting a non-linear function to the sequence of values, determining a projected time at which the non-linear function reaches a target value; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the projected time.

Abstract translation: 控制抛光的方法包括抛光衬底，用原位监测系统在抛光过程中监测衬底，从原位监测系统的测量产生一系列值，将非线性函数拟合到数值序列， 确定非线性函数达到目标值的预计时间; 以及基于所述预计时间确定抛光终点或抛光速率的调整中的至少一个。

公开(公告)号：WO2012051121A3

公开(公告)日：2012-06-21

申请号：PCT/US2011055642

申请日：2011-10-10

Applicant: APPLIED MATERIALS INC ,  DAVID JEFFREY DRUE ,  BENVEGNU DOMINIC J ,  HU XIAOYUAN

Inventor： DAVID JEFFREY DRUE ,  BENVEGNU DOMINIC J ,  HU XIAOYUAN

IPC: H01L21/304 ,  H01L21/66

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/12 ,  H01L21/3212 ,  H01L22/12

Abstract: A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.

Abstract translation: 控制抛光的方法包括：存储具有多个参考光谱的库，抛光衬底，在抛光期间测量来自衬底的光的光谱序列，对于光谱序列的每个测量光谱，使用 除了平方差的和以产生最佳匹配参考光谱的序列之外的匹配技术，以及基于最佳匹配参考光谱的序列来确定抛光终点或抛光速率的调整中的至少一个。 找到最佳匹配的参考光谱可以包括执行所测量的光谱与来自文库的多个参考光谱中的两个或更多个的互相关，并且选择与所测量的光谱具有最大相关性的参考光谱作为最佳匹配参考 光谱。

公开(公告)号：WO2012051121A2

公开(公告)日：2012-04-19

申请号：PCT/US2011/055642

申请日：2011-10-10

Applicant: APPLIED MATERIALS, INC. ,  DAVID, Jeffrey Drue ,  BENVEGNU, Dominic J. ,  HU, Xiaoyuan

Inventor： DAVID, Jeffrey Drue ,  BENVEGNU, Dominic J. ,  HU, Xiaoyuan

IPC: H01L21/304 ,  H01L21/66

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/12 ,  H01L21/3212 ,  H01L22/12

Abstract: A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.

Abstract translation: 控制抛光的方法包括存储具有多个参考光谱的库，抛光衬底，在抛光期间测量来自衬底的光的光谱序列，对于光谱序列的每个测量光谱 ，使用不同于平方差平方和的匹配技术来找到最佳匹配参考谱以产生最佳匹配参考谱的序列，以及基于最佳匹配序列来确定抛光终点或抛光速率的调整中的至少一个 参考光谱。 寻找最佳匹配参考光谱可以包括执行测量光谱与来自库的多个参考光谱中的两个或更多个中的每一个的互相关，并选择与测量光谱具有最大相关性的参考光谱作为最佳匹配参考 谱。

公开(公告)号：WO2011142975A2

公开(公告)日：2011-11-17

申请号：PCT/US2011034215

申请日：2011-04-27

Applicant: APPLIED MATERIALS INC ,  SWEDEK BOGUSLAW A ,  BENVEGNU DOMINIC J

Inventor： SWEDEK BOGUSLAW A ,  BENVEGNU DOMINIC J

IPC: H01L21/304

CPC classification number: B24B37/013 ,  B24B37/16 ,  B24B37/205 ,  B24B37/26

Abstract: A polishing pad includes a polishing layer having a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The solid light-transmitting window has an upper portion with a first lateral dimension and a lower portion with a second lateral dimension that is smaller than the first lateral dimension. A top surface of the solid light-transmitting window coplanar with the polishing surface and a bottom surface of the solid light-transmitting window coplanar with a lower surface of the adhesive layer.

Abstract translation: 抛光垫包括具有抛光表面的抛光层，与抛光层相对的抛光层一侧的粘合剂层，以及延伸穿过模制到抛光层的固体透光窗。 固体透光窗具有具有第一横向尺寸的上部和具有小于第一横向尺寸的第二横向尺寸的下部。 固体透光窗的顶表面与抛光表面共面并且固体透光窗的底表面与粘合剂层的下表面共面。

公开(公告)号：WO2011129959A2

公开(公告)日：2011-10-20

申请号：PCT/US2011/029468

申请日：2011-03-22

Applicant: APPLIED MATERIALS, INC. ,  SWEDEK, Boguslaw A. ,  BENNETT, Doyle E. ,  BENVEGNU, Dominic J.

Inventor： SWEDEK, Boguslaw A. ,  BENNETT, Doyle E. ,  BENVEGNU, Dominic J.

IPC: H01L21/304 ,  H01L21/66

CPC classification number: B24B37/205

Abstract: A polishing pad includes a polishing layer having a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The solid light-transmitting window has an upper portion with a first lateral dimension and a lower portion with a second lateral dimension that is smaller than the first lateral dimension. A top surface of the solid light-transmitting window coplanar with the polishing surface and a bottom surface of the solid light-transmitting window coplanar with a lower surface of the adhesive layer.

Abstract translation: 抛光垫包括具有抛光表面的抛光层，与抛光层相对的抛光层一侧的粘合剂层，以及延伸穿过模制到抛光层的固体透光窗。 固体透光窗具有具有第一横向尺寸的上部和具有小于第一横向尺寸的第二横向尺寸的下部。 固体透光窗的顶表面与抛光表面共面并且固体透光窗的底表面与粘合剂层的下表面共面。

公开(公告)号：WO2011056485A2

公开(公告)日：2011-05-12

申请号：PCT/US2010/053863

申请日：2010-10-22

Applicant: APPLIED MATERIALS, INC. ,  DAVID, Jeffrey, Drue ,  LEE, Harry, Q. ,  BENVEGNU, Dominic, J. ,  SWEDEK, Boguslaw, A.

Inventor： DAVID, Jeffrey, Drue ,  LEE, Harry, Q. ,  BENVEGNU, Dominic, J. ,  SWEDEK, Boguslaw, A.

IPC: H01L21/66 ,  H01L21/304

CPC classification number: G05B19/418 ,  B24B37/013 ,  B24B37/042 ,  B24B37/205 ,  B24B49/12 ,  G05B2219/45232

Abstract: In one aspect, a method of polishing includes polishing a substrate, and receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing. The method includes measuring a sequence of spectra of light reflected from the substrate while the substrate is being polished, where at least some of the spectra of the sequence differ due to material being removed during the polishing. The method of polishing includes determining a value of a characteristic of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of values for the characteristic, fitting a function to the sequence of values, and determining either a polishing endpoint or an adjustment for a polishing rate based on the function.

Abstract translation: 在一个方面，抛光方法包括抛光衬底，并且接收在抛光期间监测的选择的光谱特征和所选择的光谱特征的特征的识别。 该方法包括在抛光衬底时测量从衬底反射的光的光谱序列，其中该序列的至少一些光谱由于在抛光期间被去除材料而不同。 抛光方法包括确定光谱序列中每个光谱的所选光谱特征的特征值，以产生特征值的序列，将函数拟合到该值序列，并且确定抛光 终点或根据功能调整抛光速率。

公开(公告)号：WO2010062910A2

公开(公告)日：2010-06-03

申请号：PCT/US2009/065772

申请日：2009-11-24

Applicant: APPLIED MATERIALS, INC. ,  DAVID, Jeffrey Drue ,  LEE, Harry Q. ,  SWEDEK, Boguslaw A. ,  BENVEGNU, Dominic J. ,  ZHU, Zhize ,  TU, Wen-Chiang

Inventor： DAVID, Jeffrey Drue ,  LEE, Harry Q. ,  SWEDEK, Boguslaw A. ,  BENVEGNU, Dominic J. ,  ZHU, Zhize ,  TU, Wen-Chiang

IPC: H01L21/304

CPC classification number: B24B37/013 ,  B24B49/12 ,  H01L22/12 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method includes polishing a substrate on a first platen using a first set of parameters, obtaining a plurality of measured spectra from at least two zones, comparing the plurality of measured spectra with a reference spectrum to evaluate the thickness of each of the at least two zones of the substrate, comparing a thickness of a first zone with a thickness of a second zone, determining whether the thickness of the first zone falls within a predetermined range of the thickness of the second zone, and if the thickness does not fall within the predetermined range, at least one of a) adjusting at least one parameter of the first set and polishing a second substrate on the first platen using the adjusted parameters, or b) adjusting at least one parameter of a second set and polishing the substrate on a second platen using the adjusted parameters.

Abstract translation: 一种方法包括使用第一组参数来抛光第一台板上的基板，从至少两个区域获得多个测量光谱，将多个测量光谱与参考光谱进行比较，以评估至少两个 区域，比较第一区域的厚度和第二区域的厚度，确定第一区域的厚度是否落在第二区域的厚度的预定范围内，并且如果厚度不在第二区域的厚度内 预定范围，以下至少一个：a）调整第一组的至少一个参数并使用经调整的参数来研磨第一台上的第二基板，或b）调整第二组的至少一个参数并在一个 第二台板使用调整参数。

公开(公告)号：WO2008070736A8

公开(公告)日：2008-08-07

申请号：PCT/US2007086535

申请日：2007-12-05

Applicant: APPLIED MATERIALS INC ,  BENVEGNU DOMINIC J ,  DAVID JEFFREY DRUE ,  SWEDEK BOGUSLAW A ,  ZHANG JIMIN ,  LEE HARRY Q

Inventor： BENVEGNU DOMINIC J ,  DAVID JEFFREY DRUE ,  SWEDEK BOGUSLAW A ,  ZHANG JIMIN ,  LEE HARRY Q

IPC: G01N21/55 ,  G01B11/06 ,  G01N21/84

CPC classification number: G01B11/0683 ,  G01N21/55

Abstract: Methods of subtracting the contribution of anon-dielectric, e.g., copper, to spectra obtained from a substrate during chemical mechanical polishing are described A method of optically determining the amount of area on a substrate that includes a non-dielectric material by making use of a broad band reflectance spectrum of the surface and in particular to determining the concentration of metal such as copper coverage on the surface of a substrate as the substrate is polished. The method is directed to reliably determining the endpoint via the spectral interference pattern resulting from reflections from dielectric regions when adjacent regions of the substrate are covered by metal which reflects strongly over the whole wavelength range considered and which tend to mask the reflectance spectrum from the adjacent dielectric regions.

Abstract translation: 在化学机械抛光期间减去非电介质（例如铜）对从衬底获得的光谱的贡献的方法描述了一种通过利用以下方法光学确定包括非介电材料的衬底上的面积的量的方法： 特别是确定衬底抛光后的衬底表面上金属的浓度，例如铜的覆盖范围。 该方法旨在通过由介电区域的反射产生的光谱干涉图形可靠地确定端点，当基板的相邻区域被金属覆盖时，该金属在所考虑的整个波长范围内强烈反射，并且倾向于掩盖相邻的反射光谱 电介质区域。

公开(公告)号：WO2007024807A2

公开(公告)日：2007-03-01

申请号：PCT/US2006032659

申请日：2006-08-21

Applicant: APPLIED MATERIALS INC ,  BENVEGNU DOMINIC J ,  DAVID JEFFREY DRUE ,  SWEDEK BOGDAN ,  LEE HARRY Q ,  KARUPPIAH LAKSHMANAN

Inventor： BENVEGNU DOMINIC J ,  DAVID JEFFREY DRUE ,  SWEDEK BOGDAN ,  LEE HARRY Q ,  KARUPPIAH LAKSHMANAN

IPC: B24B37/04 ,  B24B49/12

CPC classification number: B24B37/042 ,  B24B37/205 ,  B24B49/12

Abstract: Apparatus and methods for spectrum based monitoring of chemical mechanical polishing, including spectrum based endpointing, spectrum based polishing rate adjustment, flushing a top surface of an optical head, or a pad with a window. The spectrum-based endpointing uses a reference spectrum which is empirically selected for particular spectrum based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum based endpoint logic. The polishing endpoint can be determined using a difference trace or a sequence of index values. The flushing system creates a laminar gas flow across the top surface of the optical head. The vacuum nozzle and vacuum sources are configured so that the flow if gas is laminar. The window includes a soft plastic portion and a crystalline or glass like portion. The spectrum based polishing rate adjustment includes obtaining spectra for different zones on a substrate.

Abstract translation: 用于基于频谱的化学机械抛光监测的装置和方法，包括基于光谱的终点，基于光谱的抛光速率调节，冲洗光学头的顶表面或具有窗口的垫。 基于频谱的终点使用参考频谱，该参考频谱是针对特定的基于频谱的端点确定逻辑进行经验选择的，以便通过应用特定的基于频谱的端点逻辑来调用端点时实现目标厚度。 可以使用差异迹线或索引值序列来确定抛光终点。 冲洗系统在光学头的顶表面上产生层流气流。 真空喷嘴和真空源被配置为使得气体是层流的流动。 窗口包括软塑料部分和结晶或玻璃状部分。 基于光谱的抛光速率调节包括获得基底上不同区域的光谱。