公开(公告)号：WO2009096896A1

公开(公告)日：2009-08-06

申请号：PCT/SG2008/000034

申请日：2008-01-31

Applicant: ADVANCED SYSTEMS AUTOMATION LIMITED ,  LIM, Kian Hock ,  NG, Lian Seng ,  TAN, Lian Aik ,  GUAN, QingFeng

Inventor： LIM, Kian Hock ,  NG, Lian Seng ,  TAN, Lian Aik ,  GUAN, QingFeng

IPC: H01L21/673 ,  H01L21/68 ,  B65D85/86 ,  H05K13/00

CPC classification number: H01L21/67333

Abstract: Semiconductor devices are typically manufactured from strips. The semiconductor devices are then separated from the strips into individual units. The individual units are washed, dried and placed into rows of component pockets located on JEDEC matrix trays (trays). However, tray warping tends to occur at the centre of the trays due to improper securing of the trays thereby resulting in misaligned component pockets. Hence, the individual units are not accurately positioned and secured into the component pockets. Additionally, the size of the individual units further worsens the problem of tray-warping as the individual units are easily displaceable from the component pockets when not properly secured in the component pockets. An embodiment of the invention describes an apparatus and a method for un-warping trays used for containing semiconductor devices.

Abstract translation: 半导体器件通常由条带制造。 然后将半导体器件与条分离成单独的单元。 将各个单元洗涤，干燥并放置在位于JEDEC基质托盘（托盘）上的成排袋中。 然而，由于托盘的不正确固定，托盘翘曲倾向于在托盘的中心处发生，从而导致不对齐的部件袋。 因此，各个单元不能精确地定位并固定到组件袋中。 此外，由于当未正确地固定在组件袋中时，各个单元可容易地从组件袋移动，所以单个单元的尺寸进一步恶化了托盘翘曲的问题。 本发明的实施例描述了用于容纳半导体器件的用于不翘曲的托盘的装置和方法。