Abstract:
Methods and apparatus for assessing a constituent in a semiconductor substrate. Several embodiments of the invention are directed toward non-contact methods and systems for identifying an atom specie of a dopant implanted into the semiconductor substrate using techniques that do not mechanically contact the substrate with electrical leads or other types of mechanical measuring instruments. For example, one embodiment of a non-contact method of assessing a constituent in a semiconductor substrate in accordance with the invention comprises obtaining an actual reflectance spectrum of infrared radiation reflected from the semiconductor substrate, and ascertaining a plasma frequency value (ω p ) and a collision frequency value (γ) for the semiconductor substrate based on the actual reflectance spectrum. This method can further include identifying a dopant type based on a relationship between dopant types and (a) plasma frequency values and (b) collision frequency values.
Abstract:
An optical metrology device (100) produces a broadband beam of light (104) that is incident on and reflected by a sample (108) and introduces multiple variations in the polarization state of the beam of light induced by an optical chiral element (118). Using the detected light, the Muller matrix or partial Mueller matrix for the sample is determined, which is then used to determine a characteristic of the sample. For example, simulated spectra for a Mueller matrix for a model is fit to the measured spectra for the Mueller matrix of the sample by adjusting the parameters of the model until an acceptable fit between the simulated spectra and measured spectra from the Mueller matrices is produced. The varied parameters are then used as the sample parameters of interested, which can be reported, such as by storing in memory or displaying.
Abstract:
Methods and apparatus for assessing a constituent in a semiconductor substrate. Several embodiments of the invention are directed toward non-contact methods and systems for identifying an atom specie of a dopant implanted into the semiconductor substrate using techniques that do not mechanically contact the substrate with electrical leads or other types of mechanical measuring instruments. For example, one embodiment of a non-contact method of assessing a constituent in a semiconductor substrate in accordance with the invention comprises obtaining an actual reflectance spectrum of infrared radiation reflected from the semiconductor substrate, and ascertaining a plasma frequency value (? p ) and a collision frequency value (?) for the semiconductor substrate based on the actual reflectance spectrum. This method can further include identifying a dopant type based on a relationship between dopant types and (a) plasma frequency values and (b) collision frequency values.