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公开(公告)号:WO2023012543A1
公开(公告)日:2023-02-09
申请号:PCT/IB2022/056058
申请日:2022-06-29
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: LEE, Hae-Seung Harry
IPC: C08G77/14 , C09D183/06
Abstract: A reactive primer compound is provided that can be used as an adhesion promoter on various substrates, particularly metal-containing substrates. The reactive primer compound has a diketone group that can form chelates with various metals through coordination chemistry plus an oxirane group that can undergo ring opening reactions with components of an adhesive or coating composition. Articles containing a metal-containing substrate and a primer layer, which includes the reactive primer compound, positioned adjacent the metal-containing substrate are also provided. The articles can further include a cured composition or a cured composition formed therefrom, wherein the curable composition typically includes an epoxy resin and a curative for the epoxy resin.
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公开(公告)号:WO2023012542A1
公开(公告)日:2023-02-09
申请号:PCT/IB2022/056055
申请日:2022-06-29
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: LEE, Hae-Seung Harry
IPC: C08G75/045 , C08F8/00 , C08F283/00 , C08L81/02 , C09J4/00
Abstract: A reactive primer compound is provided that can be used as an adhesion promoter on various substrates, particularly metal-containing substrates. The reactive primer compound has a diketone group that can form chelates with various metals through coordination chemistry plus an oxirane group that can undergo ring opening reactions with components of an adhesive or coating composition. Articles containing a metal-containing substrate and a primer layer, which includes the reactive primer compound, positioned adjacent the metal-containing substrate are also provided. The articles can further include a cured composition or a cured composition formed therefrom, wherein the curable composition typically includes an epoxy resin and a curative for the epoxy resin.
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公开(公告)号:WO2020254945A1
公开(公告)日:2020-12-24
申请号:PCT/IB2020/055583
申请日:2020-06-15
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: LEE, Hae-Seung Harry , KIM, Youhoon
IPC: C08F2/48 , C08F8/44 , C08F220/18 , C09J133/08
Abstract: Antistatic polymers including divalent segments represented by formula a) wherein R 1 represents hydrogen or methyl, R 2 represents an alkylene group having from 1 to 10 carbon atoms, R 3 and R 4 independently represent alkyl groups having from 1 to 4 carbon atoms, and X represents a halogen. Methods of making antistatic polymers and uses thereof as PSAs are also disclosed. a)
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公开(公告)号:WO2023073470A1
公开(公告)日:2023-05-04
申请号:PCT/IB2022/059781
申请日:2022-10-12
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: PYUN, Eumi , LEE, Hae-Seung Harry
IPC: C08F8/40 , C08F220/18
Abstract: A method of making a (meth)acrylate copolymer having pendent phosphate-containing groups and a pressure-sensitive adhesive that contains the (meth)acrylate copolymer having pendent phosphate-containing groups are provided. The method includes reacting a precursor (meth)acrylate copolymer having pendent carboxylic acid groups with an epoxy-functionalized phosphate compound. The pendent phosphate-containing groups on the reaction product can function as a flame retardant for the pressure-sensitive adhesive.
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公开(公告)号:WO2023042009A1
公开(公告)日:2023-03-23
申请号:PCT/IB2022/057798
申请日:2022-08-19
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: LEE, Hae-Seung Harry , AUSTIN, Steven R. , KRYGER, Matthew J.
IPC: C07C323/52 , B32B7/12 , B32B15/20 , B32B33/00 , C08G75/045
Abstract: A primer compound is provided that can be used as an adhesion promoter on various substrates, particularly metal-containing substrates. Articles containing a metal-containing substrate and a primer layer, which includes the primer compound, positioned adjacent to the substrate are also provided. The articles often include an adhesive layer with the primer layer positioned between the metal-containing substrate and the adhesive layer. The primer compound has a diketone group that can form chelates with various metals through coordination chemistry plus a thiol group that can react with components in the adhesive layer.
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