公开(公告)号：WO2018094057A1

公开(公告)日：2018-05-24

申请号：PCT/US2017/062030

申请日：2017-11-16

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： MAHAJAN, Ankit ,  PEKUROVSKY, Mikhail L. ,  STAY, Matthew S. ,  THEIS, Daniel J. ,  GILMAN, Ann M. ,  DODDS, Shawn C. ,  METZLER, Thomas J. ,  SMITH, Matthew R. D. ,  BARTON, Roger W. ,  HERNANDEZ, Joseph E. ,  SHAH, Saagar A. ,  MEYERS, Kara A. ,  ZHU, James ,  GOEDDEL, Teresa M. ,  PEKUROVSKY, Lyudmila A. ,  KEMLING, Jonathan W. ,  LARSEN, Jeremy K. ,  CHIU, Jessica ,  NICCUM, Kayla

IPC分类号： H01L25/07 ,  H01L27/02

摘要： Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.