Abstract:
The machine comprises: a working head (12) with a focussing device (18) arranged to focus a laser beam on the surface of the tube or profiled section (T) to be worked, a carriage (26) on which the working head (12) is mounted and a scanning system (20) arranged to scan at least a portion of the outline of the cross-section of the tube or profiled section (T). The carriage (26) is able to translate with respect to the tube or profiled section (T) both in a longitudinal direction (x) coinciding with the longitudinal axis of the tube or profiled section (T) and in a transverse direction (y). The scanning system (20) comprises at least one laser scanning module (20) comprising a laser emitter (22) arranged to emit a light blade (L) with which to illuminate a portion of the tube or profiled section (T) and a camera (24) arranged to acquire an image of the portion of tube or profiled section (T) illuminated by the light blade (L). The working head (12) and the at least one laser scanning module (20) are mounted on the carriage (26) so as to be drivingly connected for translation with said carriage (26) both in the longitudinal direction (x) and in the transverse direction (y).
Abstract:
According to the invention, a laser cutting process is controlled using as reference signal one or more emission lines which are characteristic of the radiation emitted by a gas (be it an assisting gas or a contaminant gas) or, more generally, by an emitting element present in the volume irradiated by the laser beam focussed by a laser head (12) and adjusting, on the base of this reference signal, at least one of the following process control parameters: the power of the laser, the frequency and the duty cycle of the laser pulse, the pressure of an assisting gas emitted by a nozzle (16) forming part of the laser head (12), the relative speed of the laser head (12) with respect to the workpiece (P), the distance between the laser head (12) and the surface (S) of the workpiece (P), and the distance between the focal point (F) of the laser beam and the surface (S) of the workpiece (P).