公开(公告)号：WO2021122987A1

公开(公告)日：2021-06-24

申请号：PCT/EP2020/086760

申请日：2020-12-17

Applicant: ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY

Inventor： LAKSHMANAN, Ramji Sitaraman ,  STENSON, Bernard ,  FITZGERALD, Padraig Liam ,  KIERSE, Oliver ,  TWOHIG, Michael James ,  FLYNN, Michael John ,  O'SULLIVAN, Laurence Brendan

IPC: H01L21/52 ,  H01L23/04 ,  H01L2224/04 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/056 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2405 ,  H01L2224/24227 ,  H01L2224/245 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/32013 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/32237 ,  H01L2224/33183 ,  H01L2224/40225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81207 ,  H01L2224/82002 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/85002 ,  H01L2224/85005 ,  H01L2224/85801 ,  H01L2224/9205 ,  H01L23/041 ,  H01L23/06 ,  H01L23/13 ,  H01L23/20 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/562 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16196 ,  H01L2924/163

Abstract: An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.