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公开(公告)号:WO2019195288A1
公开(公告)日:2019-10-10
申请号:PCT/US2019/025384
申请日:2019-04-02
Applicant: APPLE INC.
Inventor: SIAHAAN, Edward , BLOOM, Daniel R. , PANECKI, Lee M. , QIAN, Phillip , SHAFFER, Benjamin A. , STRINGER, Christopher J. , WHANG, Eugene A. , NARAJOWSKI, David H. , OSHITA, Scott Y. , HATFIELD, Dustin A. , SEGRAVES, Zachary G. , DOCHERTY, Sean J.
IPC: H04R5/033
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号:WO2014197735A1
公开(公告)日:2014-12-11
申请号:PCT/US2014/041165
申请日:2014-06-05
Applicant: APPLE INC.
Inventor: WHANG, Eugene A. , STRINGER, Christopher J. , DEGNER, Brett W. , NARAJOWSKI, David H. , KESSLER, Patrick , PRATHER, Eric R. , KALINOWSKI, Caitlin Elizabeth , STAGNARO, Adam T. , MCBROOM, Daniel L. , CASEBOLT, Matthew P. , MCBROOM, Michael D. , SIN, Mark K. , BAKER, Paul A. , LIANG, Frank F.
IPC: G06F1/16
Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.
Abstract translation: 描述了至少具有由外壳包围的中心芯片的桌面计算系统,所述壳体具有限定其中心芯所在的体积的形状。 壳体包括从第一开口轴向移位的第一开口和第二开口。 第一开口具有根据用作冷却内部部件的传热介质的气流量的尺寸和形状,第二开口由唇缘限定,该唇缘以一定的方式接合气流的一部分,使得至少一些 传递到来自内部部件的空气流的热量被传递到壳体。
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公开(公告)号:WO2014197731A1
公开(公告)日:2014-12-11
申请号:PCT/US2014/041160
申请日:2014-06-05
Applicant: APPLE INC.
Inventor: DEGNER, Brett W. , PRATHER, Eric R. , NARAJOWSKI, David H. , LIANG, Frank F. , NIGEN, Jay S. , DYBENKO, Jesse T. , DUKE, Connor R. , WHANG, Eugene A. , STRINGER, Christopher J. , BANKO, Joshua D. , KALINOWSKI, Caitlin Elizabeth , BERK, Jonathan L. , CASEBOLT, Matthew P. , FETTERMAN, Kevin S. , WEIRSHAUSER, Eric J.
IPC: G06F1/20
Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.
Abstract translation: 本申请描述了关于用于为具有小外形尺寸的轻便且耐用的小型计算系统提供有效散热的系统和方法的各种实施例。 紧凑型计算系统可以采用台式计算机的形式。 台式计算机可以包括具有形成在其中的集成支撑系统的整体式顶壳,该集成支撑系统提供结构支撑,其通过顶壳分布施加的载荷,从而防止翘曲和弯曲。 利用混流风扇有效地将冷却空气拉过小型计算系统。
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