Abstract:
An example device in accordance with an aspect of the present disclosure includes a first member and a second member. The first member is to receive a fastener to physically secure an M.2 device, and is mountable to a printed circuit board (PCB) to electrically couple with a first trace of the PCB. The second member is to receive the fastener, and is mountable to the PCB to electrically couple with a second trace of the PCB. The first and second members are to receive the fastener to electrically couple the first trace to the second trace via the fastener and the first and second members.
Abstract:
A back-plane connector connects component boards for a cubesat with a processing unit and a board connector electrically connected to the back-plane connector. The board connector mates with complimentary connectors on the component boards. The arrangement facilitates assembly, testing and operational reliability. An image capture system may be included and has an image capture device with a multiplexer for interactive collection and storage of image and video data.
Abstract:
A Next Generation Form Factor (NGFF) carrier includes a flat component perpendicularly connected to two flat side components to receive an NGFF module, a bar rotatably connected to the two flat side components, and a number of holds along an interior of the flat component to receive a fastener. The NGFF module is insertable in relation to the flat component when the bar is rotated to a first position and fixed on the flat component when the bar is rotated to a second position.
Abstract:
Example implementations relate to a retention assembly. One example retention assembly includes a support member extending from a printed circuit board. The support member includes a body region having a slot and a first flange extending from the body region. The retention assembly also includes a locking member slidably coupled to the support member via the slot. The locking member includes a second flange. The second flange includes a protruded region, and wherein the protruded region and the first flange are to secure a proximal end of expansion module.
Abstract:
An example device in accordance with an aspect of the present disclosure includes a unibody socket to receive a memory module that is to interface with a computing system. A portion of the unibody socket extends into a latch extension. The latch extension is to retain the memory module based on a positive locking latch retention force that is to increase in response to an unseating force of the memory module, to prevent removal of the memory module while the latch extension is in a latched position.
Abstract:
A mounting device is disclosed. The mounting device has a handle rotatable between an open position and a closed position. The handle has latching features at each end that couple to mating latching features. As the handle is rotated from its open position towards its closed position, the latching features force the handle towards the mating latching features.
Abstract:
Anordnung (AO) für einen Bladeservereinschub, welche eine Hauptplatine (HP) mit einem Steckverbinder (SV) aufweist. Die Anordnung (AO) weist weiter eine in den Steckverbinder (SV) der Hauptplatine (HP) eingesteckte Riserkarte (RK) auf. In dem Bladeservereinschub ist im Wesentlichen parallel zu der Hauptplatine ein Trägerblech (TB) mit einer ersten Öffnung (OE1) festgelegt, welche fluchtend mit freiliegenden Steckkontakten (SK) der eingesteckten Riserkarte (RK) angeordnet ist. Die Anordnung (AO) weist des Weiteren ein Halteelement (HE) auf, welches einen Grundkörper (GK) mit einer durchgängigen, zweiten Öffnung (OE2) aufweist, wobei das Halteelement (HE) dazu eingerichtet ist, mittels der zweiten Öffnung (OE2) formschlüssig auf die Riserkarte (RK) aufgeschoben zu werden und mit dem Trägerblech (TB) zu verrasten, sodass die Riserkarte (RK) mechanisch sicher an dem Trägerblech (TB) festgelegt ist und die Steckkontakte (SK) der Riserkarte (RK) über die zweite Öffnung (OE2) zugänglich sind.
Abstract:
An electronic module cooling apparatus and method for cooling a plurality of electronic modules each including a circuit board to which one or more electronic components are mounted, in particular memory modules, disposed on a substrate in spaced-apart parallel relationship. The apparatus and method provide for effective cooling of the electronic modules while still allowing for insertion and removal of the electronic modules from a common substrate and/or providing for biased contact with electrical components of the electronic modules. In a particular embodiment, the apparatus provides for liquid cooling memory boards, allowing heat to be removed from the electronic components that are contained in densely populated enclosures without the need for air flow.
Abstract:
Systems and methods for intelligent and flexible management and monitoring of computer systems are provided using platform management controllers (PMCs) located on circuit boards of a computer system. The PMCs provide for enhanced circuit board certification and security, enhanced systems monitoring and reporting, and enhanced systems control. The PMCs also allow for emulation of processor-based devices and are low-power, low-cost and very fast when compared to the devices replaced and functionality provided. A power supply tracking apparatus helps to ensure that a first power input to an operational circuit maintains a predefined relationship to a second power input to the operational circuit. Systems and methods for receiving computer systems diagnostics information and for customizably displaying such information from a diagnostics monitoring device are incorporated into a computer system. The monitored computer system information is transmitted to a diagnostics device, such as by infrared or by a novel temporary wired connection.