公开(公告)号：WO2021145992A1

公开(公告)日：2021-07-22

申请号：PCT/US2020/064768

申请日：2020-12-14

Applicant: APPLIED MATERIALS, INC.

Inventor： LIANG, Qiwei ,  NEMANI, Srinivas D. ,  YING, Chentsau Chris ,  YIEH, Ellie Y. ,  CHEN, Erica ,  ALEX, Nithin Thomas

IPC: C23C16/505 ,  C23C16/458 ,  C23C16/46 ,  C23C16/26 ,  C23C16/513 ,  H01J2237/3321 ,  H01J37/321 ,  H01L21/0228

Abstract: A method and apparatus for depositing a carbon compound on a substrate includes using an inductively coupled plasma (ICP) chamber with a chamber body, a lid, an interior volume, a pumping apparatus, and a gas delivery system and a pedestal for supporting a substrate disposed within the interior volume of the ICP chamber, the pedestal has an upper portion formed from aluminum nitride with an upper surface that is configured to support and heat a substrate with embedded heating elements and a lower portion with a tube-like structure formed from aluminum nitride that is configured to support the upper portion and house electrodes for supplying power to the embedded heating elements of the upper portion, and the pedestal is configured to heat the substrate during deposition of a carbon compound film.

公开(公告)号：WO2022205461A1

公开(公告)日：2022-10-06

申请号：PCT/CN2021/085424

申请日：2021-04-02

Applicant: APPLIED MATERIALS, INC. ,  SUN, Jiayi

Inventor： LUBOMIRSKY, Dmitry ,  HANSON, Kyle M. ,  BUCHBERGER, Jr. Douglas A. ,  TSO, Alan L. ,  KOZHIKKALKANDI, Rahul ,  MCHUGH, Paul R. ,  SUN, Jiayi ,  LIANG, Qiwei ,  ALEX, Nithin Thomas ,  HUANG, Lance ,  YIEH, Ellie Y.

IPC: H01L21/67

Abstract: Apparatus and method for substrate processing are described herein. More specifically, the apparatus and method are directed towards apparatus and method for performing a field guided post exposure bake operation on a semiconductor substrate. The apparatus is a processing module (100) and includes an upper portion (102) with an electrode (400) and a base portion (104) which is configured to support a substrate (500) on a substrate support surface (159). The upper portion (102) and the base portion (104) are actuated toward and away from one another using one or more arms (112) and form a process volume(404). The process volume (404) is filled with a process fluid and the processing module (100) is rotated about an axis(A). An electric field is applied to the substrate (500) by the electrode (400) before the process fluid is drained from the process volume (404)．