公开(公告)号：WO2020092204A1

公开(公告)日：2020-05-07

申请号：PCT/US2019/058289

申请日：2019-10-28

Applicant: APPLIED MATERIALS, INC.

Inventor： KESAPRAGADA, Sree Rangasai ,  BAKKE, Jonathan R. ,  LEE, Joung Joo ,  MEBARKI, Bencherki ,  NGAI, Christopher ,  FREED, Regina ,  THAREJA, Gaurav ,  SINGH, Tejinder ,  FERNANDEZ, Jorge Pablo

IPC: H01L21/311 ,  H01L21/02 ,  H01L21/306 ,  H01L21/768

Abstract: Methods and apparatus for processing a substrate are provided herein. In some embodiments, a method for processing a substrate includes: directing a stream of material from a PVD source toward a surface of a substrate at a non-perpendicular angle to the plane of the surface to selectively deposit the material on a top portion of one or more features on the substrate and form an overhang extending beyond a first sidewall of the one or more features; and etching a first layer of the substrate beneath the one or more features selective to the deposited material.