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    METHODS AND APPARATUS FOR ABATING ELECTRONIC DEVICE MANUFACTURING PROCESS EFFLUENT
    1.
    发明申请
    METHODS AND APPARATUS FOR ABATING ELECTRONIC DEVICE MANUFACTURING PROCESS EFFLUENT 审中-公开
    电子设备制造工艺流程的方法和装置

    公开(公告)号：WO2010006181A2

    公开(公告)日：2010-01-14

    申请号：PCT/US2009/050125

    申请日：2009-07-09

    Applicant: APPLIED MATERIALS, INC. ,  FOX, Allen ,  CLARK, Daniel, O. ,  HOOSHDARAN, Frank, F. ,  FLIPPO, Belynda

    Inventor： FOX, Allen ,  CLARK, Daniel, O. ,  HOOSHDARAN, Frank, F. ,  FLIPPO, Belynda

    IPC: H01L21/00 ,  H01L21/02

    CPC classification number: G05D21/02 ,  B01D53/005 ,  B01D53/68 ,  B01D2251/102 ,  B01D2251/202 ,  B01D2251/208 ,  B01D2257/108 ,  B01D2257/11 ,  B01D2257/2027 ,  B01D2257/204 ,  B01D2257/2047 ,  B01D2257/2066 ,  B01D2257/706 ,  B01D2258/0216

    Abstract: A thermal abatement system is provided, including: a thermal abatement reactor; an inlet in fluid communication with the reactor; a process chamber in fluid communication with the inlet; a first sheathing fluid source in fluid communication with the inlet; a first flow control device, adapted to regulate a flow of a first sheathing fluid from the first sheathing fluid source; and a controller, in signal communication with the first flow control device, adapted to regulate the sheathing fluid by operating the first flow control device; wherein the inlet is adapted to receive an effluent stream from the process chamber and the first sheathing fluid from the first sheathing fluid source, to sheathe the effluent stream with the first sheathing fluid to form a sheathed effluent stream, and to introduce the sheathed effluent stream into the reactor.

    Abstract translation: 提供了一种减热系统，包括：热消除反应器; 与反应器流体连通的入口; 与入口流体连通的处理室; 与入口流体连通的第一护套流体源; 第一流量控制装置，适于调节来自第一护套流体源的第一护套流体的流动; 以及与第一流量控制装置进行信号通信的控制器，适于通过操作第一流量控制装置来调节护套流体; 其中所述入口适于接收来自所述处理室的流出物流和来自所述第一护套流体源的所述第一护套流体，以将所述流出物流与所述第一护套流体包裹以形成护套流出物流，并且将所述护套流出物流 进入反应堆。

    METHODS AND APPARATUS FOR OPERATING AN ELECTRONIC DEVICE MANUFACTURING SYSTEM
    2.
    发明申请
    METHODS AND APPARATUS FOR OPERATING AN ELECTRONIC DEVICE MANUFACTURING SYSTEM 审中-公开
    用于操作电子设备制造系统的方法和装置

    公开(公告)号：WO2009100163A1

    公开(公告)日：2009-08-13

    申请号：PCT/US2009/033125

    申请日：2009-02-04

    Applicant: APPLIED MATERIALS, INC. ,  CLARK, Daniel, O. ,  CHANDLER, Phil ,  CRAWFORD, Shaun, W. ,  JUNG, Jay, J. ,  LOLDJ, Youssef, A. ,  CAYER, Maxime

    Inventor： CLARK, Daniel, O. ,  CHANDLER, Phil ,  CRAWFORD, Shaun, W. ,  JUNG, Jay, J. ,  LOLDJ, Youssef, A. ,  CAYER, Maxime

    IPC: G05B19/418 ,  G05B19/05

    CPC classification number: G05B19/418 ,  G05B2219/31229 ,  Y02P90/02 ,  Y02P90/14

    Abstract: Methods and apparatus for efficiently operating an electronic device manufacturing system are provided. In one aspect, an electronic device manufacturing system is provided, including: a process tool; a process tool controller linked to the process tool, wherein the process tool controller is adapted to control the process tool; a first sub-fab auxiliary system linked to the process tool controller; wherein the first sub-fab auxiliary system is adapted to operate in a first operating mode and a second operating mode; and wherein the process tool controller is adapted to cause the first sub-fab auxiliary system to change from the first operating mode to the second operating mode.

    Abstract translation: 提供了有效操作电子设备制造系统的方法和设备。 一方面，提供了一种电子设备制造系统，包括：处理工具; 链接到处理工具的过程工具控制器，其中所述过程工具控制器适于控制所述过程工具; 与处理工具控制器相连的第一子制造辅助系统; 其中所述第一子晶圆厂辅助系统适于在第一操作模式和第二操作模式中操作; 并且其中所述处理工具控制器适于使所述第一子制造辅助系统从所述第一操作模式改变到所述第二操作模式。

    METHODS AND APPARATUS FOR RECOVERING HEAT FROM PROCESSING SYSTEMS
    5.
    发明申请
    METHODS AND APPARATUS FOR RECOVERING HEAT FROM PROCESSING SYSTEMS 审中-公开

    公开(公告)号：WO2010045468A3

    公开(公告)日：2010-04-22

    申请号：PCT/US2009/060857

    申请日：2009-10-15

    Applicant: APPLIED MATERIALS, INC. ,  NEUBER, Andreas ,  CLARK, Daniel, O.

    Inventor： NEUBER, Andreas ,  CLARK, Daniel, O.

    IPC: H01L21/00 ,  H01L21/02

    Abstract: Methods and apparatus for recovering heat from disposed effluents are disclosed herein. In some embodiments, an apparatus may include a first process chamber configured for gaseous or liquid processes; a second process chamber configured for liquid processes; and a heat pump having a compressor and a first heat exchanger, wherein the compressor is configured to use a first effluent exhausted from the first process chamber and wherein the first heat exchanger having first and second sides configured to transfer heat therebetween, wherein the first side is configured to flow a liquid reagent therethrough and into the second process chamber, and wherein the second side is configured to flow the pressurized first effluent from the first process chamber therethrough. In some embodiments, a heater may be disposed between the heat pump and the second process chamber to further heat the liquid reagent prior to entering the second process chamber.

    SAFETY, MONITORING AND CONTROL FEATURES FOR THERMAL ABATEMENT REACTOR
    7.
    发明申请
    SAFETY, MONITORING AND CONTROL FEATURES FOR THERMAL ABATEMENT REACTOR 审中-公开
    热回收反应器的安全，监测和控制功能

    公开(公告)号：WO2006083356A2

    公开(公告)日：2006-08-10

    申请号：PCT/US2005/042201

    申请日：2005-11-17

    Applicant: APPLIED MATERIALS, INC.

    Inventor： CHIU, Ho-man Rodney ,  CLARK, Daniel, O. ,  CRAWFORD, Shaun, W. ,  JUNG, Jay, J. ,  LOLDJ, Yousseff, A. ,  VERMEULEN, Robbert

    IPC: F23G7/06 ,  F23G5/50 ,  F23N5/24 ,  F23N5/08

    CPC classification number: F23G5/50 ,  B01D2258/0216 ,  F23G7/065 ,  F23K5/005 ,  F23N5/08 ,  F23N5/242 ,  F23N2027/02 ,  F23N2027/04 ,  F23N2029/02 ,  F23N2031/08 ,  F23N2031/18 ,  Y02C20/30 ,  Y02T50/677

    Abstract: In one or more aspects, a thermal reactor apparatus is provided that may be used to treat industrial effluent fluids, for example waste effluent produced in semiconductor and liquid crystal display manufacturing processes. Specifically, the present invention may include a system comprising a controller, a reaction chamber adapted to be controlled by the controller, a conduit into the reaction chamber, a pilot disposed at a first end of the conduit within the reaction chamber, a sensor disposed at a second end of the conduit outside of the reaction chamber that is coupled to the controller and adapted to provide an indication to the controller whether the pilot is lit, and an actuator operable to open and close the conduit. Numerous other aspects of the invention are disclosed.

    Abstract translation: 在一个或多个方面，提供了一种热反应器装置，其可用于处理工业流出物流体，例如在半导体中产生的废液和液晶显示器制造工艺。 具体地说，本发明可以包括一个系统，该系统包括一个控制器，一个适用于由控制器控制的反应室，一个进入反应室的管道，一个位于反应室内导管第一端的导管， 所述导管外部的所述导管的第二端连接到所述控制器，并且适于向所述控制器提供所述导频是否点亮的指示，以及可操作以打开和关闭所述导管的致动器。 公开了本发明的许多其它方面。

    REACTOR DESIGN TO REDUCE PARTICLE DEPOSITION DURING PROCESS ABATEMENT
    8.
    发明申请
    REACTOR DESIGN TO REDUCE PARTICLE DEPOSITION DURING PROCESS ABATEMENT 审中-公开
    减少加工过程中颗粒沉积的反应器设计

    公开(公告)号：WO2006053231A2

    公开(公告)日：2006-05-18

    申请号：PCT/US2005/040960

    申请日：2005-11-12

    Applicant: APPLIED MATERIALS, INC.

    Inventor： CHIU, Ho-Man, Rodney ,  CLARK, Daniel, O. ,  CRAWFORD, Shaun, W. ,  JUNG, Jay, J. ,  TODD, Leonard, B. ,  VERMEULEN, Robbert

    IPC: F23G7/06 ,  F23M5/08 ,  F23J9/00

    CPC classification number: F23M5/085 ,  F23D2900/00016 ,  F23G7/065 ,  F23J9/00 ,  F23M2900/05002 ,  F23M2900/05004

    Abstract: Systems and methods are provided for controlled combustion and decomposition of gaseous pollutants while reducing deposition of unwanted reaction products from within the treatment systems. Exemplary systems include a novel thermal reaction chamber design having stacked porous ceramic rings through which fluid, e.g., gases, may be directed to form a boundary layer along the interior wall of the thermal reaction chamber, thereby reducing particulate matter buildup thereon. The systems may further include the introduction of fluids from the center pilot jet to alter the aerodynamics of the interior of the thermal reaction chamber.

    Abstract translation: 系统和方法被提供用于气态污染物的受控燃烧和分解，同时减少来自处理系统内不需要的反应产物的沉积。 示例性系统包括具有堆叠多孔陶瓷环的新型热反应室设计，通过该堆叠多孔陶瓷环可以引导流体（例如气体）沿着热反应室的内壁形成边界层，由此减少堆积在其上的颗粒物质。 该系统可以进一步包括从中央引燃喷嘴引入流体以改变热反应室内部的空气动力学。

    METHODS AND APPARATUS FOR TREATING EXHAUST GAS IN A PROCESSING SYSTEM
    9.
    发明申请
    METHODS AND APPARATUS FOR TREATING EXHAUST GAS IN A PROCESSING SYSTEM 审中-公开
    在处理系统中处理排气的方法和装置

    公开(公告)号：WO2011068936A2

    公开(公告)日：2011-06-09

    申请号：PCT/US2010/058664

    申请日：2010-12-02

    Applicant: APPLIED MATERIALS, INC. ,  DICKINSON, Colin, John ,  MOALEM, Mehran ,  CLARK, Daniel, O.

    Inventor： DICKINSON, Colin, John ,  MOALEM, Mehran ,  CLARK, Daniel, O.

    IPC: H01L21/02

    CPC classification number: B01D53/32 ,  B01D53/92 ,  B01D2258/0216 ,  B01D2259/122 ,  B01D2259/80 ,  B01D2259/818 ,  C23C16/4412

    Abstract: Methods and apparatus for treating an exhaust gas in a foreline of a substrate processing system are provided herein. In some embodiments, an apparatus for treating an exhaust gas in a foreline of a substrate processing system includes a plasma source coupled to a foreline of a process chamber, a reagent source coupled to the foreline upstream of the plasma source, and a foreline gas injection kit coupled to the foreline to controllably deliver a gas to the foreline, wherein the foreline injection kit includes a pressure regulator to set a foreline gas delivery pressure setpoint, and a first pressure gauge coupled to monitor a delivery pressure of the gas upstream of the foreline.

    Abstract translation: 本文提供了用于处理衬底处理系统的前级管线中的废气的方法和装置。 在一些实施例中，用于处理衬底处理系统的前级管线中的废气的装置包括耦合到处理室的前级管线的等离子体源，耦合到等离子体源上游的前级管线的试剂源和前级气体注入 前级管线注入套件包括用于设定前级气体输送压力设定点的压力调节器，以及耦合以监测前级管线上游气体的输送压力的第一压力表， 。

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