公开(公告)号：WO2022256138A1

公开(公告)日：2022-12-08

申请号：PCT/US2022/028280

申请日：2022-05-09

Applicant: APPLIED MATERIALS, INC.

Inventor： HARTWIG, Robert ,  HUDERI SOMANNA, Dinkesh ,  WEST, Brian T.

IPC: H01L21/67 ,  H01L21/687 ,  C23C14/50 ,  C23C14/54

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a cooling apparatus for use with a substrate support of a processing chamber comprises a heat exchanger, a manifold assembly comprising a first input configured to connect to an output of the heat exchanger, a second input configured to connect to a first coolant supply configured to supply a first coolant, a first output configured to connect to the substrate support of the processing chamber, and a second output configured to connect to an input of the heat exchanger, a gas input configured to connect to a second coolant supply that is configured to supply a second coolant that is different from the first coolant to the substrate support, a first three-way valve connected between the first output of the manifold assembly and the substrate support and connected between the gas input and the substrate support, and a controller configured to control supplying one of the first coolant or the second coolant during operation.

公开(公告)号：WO2023069230A1

公开(公告)日：2023-04-27

申请号：PCT/US2022/044869

申请日：2022-09-27

Applicant: APPLIED MATERIALS, INC.

Inventor： PANDEY, Vishwas Kumar ,  DICKINSON, Colin John ,  HUDERI SOMANNA, Dinkesh ,  MORADIAN, Ala ,  SHAH, Kartik Bhupendra

IPC: C23C14/54 ,  C23C14/34 ,  C23C14/56 ,  H01J37/34

Abstract: An adapter for a deposition chamber includes an adapter body extending longitudinally about a central axis between an upper side and lower side opposite the upper side. The adapter body has a central opening about the central axis. The adapter body has a radially outer portion having a connection surface on the lower side and a radially inner portion having a coolant channel and a stepped surface on the lower side. At least a portion of the coolant channel is spaced radially inwardly from a radially inner end of the connection surface. At least the portion of the coolant channel is disposed longitudinally below the connection surface between the connection surface and the stepped surface.