公开(公告)号：WO2017180283A3

公开(公告)日：2017-10-19

申请号：PCT/US2017/022468

申请日：2017-03-15

Applicant: APPLIED MATERIALS, INC.

Inventor： HUNTER, Aaron Muir ,  BEHDJAT, Mehran ,  MERCHANT, Niraj ,  MCALLISTER, Douglas R. ,  IU, Dongming ,  CHAN, Kong Lung Samuel ,  HAWRYLCHAK, Lara

IPC: H01L21/67 ,  H01L21/54 ,  H01L21/02

Abstract: A semiconductor processing apparatus is described that has a body with a wall defining two processing chambers within the body; a passage through the wall forming a fluid coupling between the two processing chambers; a lid removably coupled to the body, the lid having a portal in fluid communication with the passage; a gas activator coupled to the lid outside the processing chambers, the gas activator having an outlet in fluid communication with the portal of the lid; a substrate support disposed in each processing chamber, each substrate support having at least two heating zones, each with an embedded heating element; a gas distributor coupled to the lid facing each substrate support; and a thermal control member coupled to the lid at an edge of each gas distributor.

公开(公告)号：WO2020236906A1

公开(公告)日：2020-11-26

申请号：PCT/US2020/033755

申请日：2020-05-20

Applicant: APPLIED MATERIALS, INC.

Inventor： LEE, Helder ,  KOPEC, Nicholas Michael ,  VOLFOVSKI, Leon ,  MCALLISTER, Douglas R. ,  SCHMID, Andreas ,  HUDGENS, Jeffrey ,  VISHWANATH, Yogananda Sarode ,  BABAYAN, Steven

IPC: H01L21/673 ,  H01L21/67 ,  H01L21/677 ,  H01J37/32

Abstract: A process kit enclosure system includes surfaces to enclose an interior volume, a first support structure including first fins, a second support structure including second fins, and a front interface to interface the process kit enclosure system with a load port of a wafer processing system. The first and second fins are sized and spaced to hold process kit ring carriers and process kit rings in the interior volume. Each of the process kit rings is secured to one of the process kit ring carriers. The process kit enclosure system enables first automated transfer of a first process kit ring carrier securing a first process kit ring from the process kit enclosure system into the wafer processing system and second automated transfer of a second process kit ring carrier securing a second process kit ring from the wafer processing system into the process kit enclosure system.

公开(公告)号：WO2015102768A9

公开(公告)日：2015-07-09

申请号：PCT/US2014/066890

申请日：2014-11-21

Applicant: APPLIED MATERIALS, INC.

Inventor： RANISH, Joseph M. ,  MCALLISTER, Douglas R.

IPC: H01L21/324

Abstract: A lamp device for thermal processing of a substrate is provided. The lamp device includes a bulb enclosing a filament, the filament having a pair of leads. The lamp device further includes a lamp base. The lamp base includes a seal connecting the bulb to the lamp base; a sleeve having one or more walls and two ends with one end surrounding the seal; a potting compound filling the sleeve; one or more wires distributed through the sleeve and the potting compound and coupled to the pair of leads; and one or more hookable features located within 10 mm of the sealing end.

公开(公告)号：WO2021016115A1

公开(公告)日：2021-01-28

申请号：PCT/US2020/042632

申请日：2020-07-17

Applicant: APPLIED MATERIALS, INC.

Inventor： HARBERT, Andrew Paul ,  KUCHAR, Michael C. ,  BERGANTZ, Nicholas Michael ,  VOLFOVSKI, Leon ,  RAMALINGAM, Sivakumar ,  MUTHUKAMATCHI, Karuppasamy ,  MCALLISTER, Douglas R.

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/673

Abstract: A method includes receiving, by a first loadlock chamber of the loadlock system, a first object from a factory interface via a first opening. The first object is transferred into the first loadlock chamber via a first robot arm. The factory interface is at a first state. The first loadlock chamber is configured to receive different types of objects. The method further includes sealing a first loadlock door against the first opening to create a first sealed environment at the first state in the first loadlock chamber and causing the first sealed environment of the first loadlock chamber to be changed to a second state. The method further includes actuating a second loadlock door to provide a second opening between the first loadlock chamber and a transfer chamber. The first object is to be transferred from the first loadlock chamber to the transfer chamber via a second robot arm.

公开(公告)号：WO2020236916A1

公开(公告)日：2020-11-26

申请号：PCT/US2020/033774

申请日：2020-05-20

Applicant: APPLIED MATERIALS, INC.

Inventor： VOLFOVSKI, Leon ,  SCHMID, Andreas ,  KOOSAU, Denis Martin ,  KOPEC, Nicholas Michael ,  BABAYAN, Steven ,  MCALLISTER, Douglas R. ,  LEE, Helder ,  HUDGENS, Jeffrey ,  COX, Damon K.

IPC: H01L21/673 ,  H01L21/67 ,  H01L21/677 ,  H01J37/32

Abstract: A process kit ring adaptor includes a rigid carrier. The rigid carrier includes an upper surface and a lower surface. The upper surface includes a first distal portion and a second distal portion to support a process kit ring. The lower surface includes a first region to interface with an end effector configured to support wafers and a solid planar central region to interface with a vacuum chuck.

公开(公告)号：WO2017180283A2

公开(公告)日：2017-10-19

申请号：PCT/US2017/022468

申请日：2017-03-15

Applicant: APPLIED MATERIALS, INC.

Inventor： HUNTER, Aaron Muir ,  BEHDJAT, Mehran ,  MERCHANT, Niraj ,  MCALLISTER, Douglas R. ,  IU, Dongming ,  CHAN, Kong Lung Samuel ,  HAWRYLCHAK, Lara

IPC: H01L21/67 ,  H01L21/54 ,  H01L21/02

Abstract: A semiconductor processing apparatus is described that has a body with a wall defining two processing chambers within the body; a passage through the wall forming a fluid coupling between the two processing chambers; a lid removably coupled to the body, the lid having a portal in fluid communication with the passage; a gas activator coupled to the lid outside the processing chambers, the gas activator having an outlet in fluid communication with the portal of the lid; a substrate support disposed in each processing chamber, each substrate support having at least two heating zones, each with an embedded heating element; a gas distributor coupled to the lid facing each substrate support; and a thermal control member coupled to the lid at an edge of each gas distributor.

Abstract translation: 描述了一种半导体加工设备，其具有在本体内具有限定两个处理室的壁的本体; 穿过壁的通道在两个处理室之间形成流体耦合; 可移除地联接到所述主体的盖，所述盖具有与所述通道流体连通的入口; 气体激活器，耦合到处理室外部的盖子，气体激活器具有与盖子的入口流体连通的出口; 设置在每个处理室中的衬底支撑件，每个衬底支撑件具有至少两个加热区，每个加热区具有嵌入式加热元件; 耦合到面对每个衬底支撑件的盖的气体分配器; 以及在每个气体分配器的边缘连接到盖子的热控制构件。

公开(公告)号：WO2015102768A1

公开(公告)日：2015-07-09

申请号：PCT/US2014/066890

申请日：2014-11-21

Applicant: APPLIED MATERIALS, INC.

Inventor： RANISH, Joseph M. ,  MCALLISTER, Douglas R.

IPC: H01L21/324

CPC classification number: H05B3/0047

Abstract: A lamp device for thermal processing of a substrate is provided. The lamp device includes a bulb enclosing a filament, the filament having a pair of leads. The lamp device further includes a lamp base. The lamp base includes a seal connecting the bulb to the lamp base; a sleeve having one or more walls and two ends with one end surrounding the seal; a potting compound filling the sleeve; one or more wires distributed through the sleeve and the potting compound and coupled to the pair of leads; and one or more hookable features located within 10 mm of the sealing end.

Abstract translation: 提供了一种用于基板的热处理的灯装置。 灯装置包括封装灯丝的灯泡，灯丝具有一对引线。 灯装置还包括灯座。 灯座包括将灯泡连接到灯座的密封件; 套筒具有一个或多个壁和两端，一端围绕密封; 填充套筒的灌封料; 一根或多根电线分布在套筒和封装化合物上并耦合到一对引线上; 以及位于密封端10mm内的一个或多个可钩形特征。

公开(公告)号：WO2010051284A2

公开(公告)日：2010-05-06

申请号：PCT/US2009/062242

申请日：2009-10-27

Applicant: APPLIED MATERIALS, INC. ,  LEIGHTON, Jamie S. ,  DESAI, Abhijit Y. ,  MCALLISTER, Douglas R.

Inventor： LEIGHTON, Jamie S. ,  DESAI, Abhijit Y. ,  MCALLISTER, Douglas R.

IPC: H01L21/304

CPC classification number: B24B57/02 ,  B24B37/04

Abstract: Embodiments of the invention provide a slurry delivery and rinse system for a chemical mechanical polishing (CMP) apparatus which is capable of self-cleaning, and which can adjustably deliver the slurry agent and rinse agent over a polishing pad. In one embodiment, the fluid delivery system has a distributed slurry delivery arm (DSDA) which contains at least one manifold, usually two or more manifolds attached to the lower surface of the delivery arm. Each DSDA manifold contains a plurality of slurry nozzles disposed along the length of the manifold. The delivery arm also contains a plurality of high pressure rinse nozzles extending from the lower surface of the delivery arm and disposed along the length of the delivery arm, parallel to each DSDA manifold. In one example, the delivery arm contains two DSDA manifolds disposed parallel to each other and a plurality of high pressure rinse nozzles disposed between the manifolds.

Abstract translation: 本发明的实施例提供了用于化学机械抛光（CMP）设备的浆液输送和冲洗系统，其能够自清洁，并且其可以可调节地将浆液剂和冲洗剂递送到抛光 垫。 在一个实施例中，流体输送系统具有分布式浆料输送臂（DSDA），其包含至少一个歧管，通常两个或更多个歧管连接至输送臂的下表面。 每个DSDA歧管包含沿歧管长度布置的多个浆料喷嘴。 输送臂还包含多个高压冲洗喷嘴，该高压冲洗喷嘴从输送臂的下表面延伸并且沿输送臂的长度平行于每个DSDA歧管设置。 在一个示例中，输送臂包含彼此平行设置的两个DSDA歧管和设置在歧管之间的多个高压冲洗喷嘴。