公开(公告)号：WO2021257889A1

公开(公告)日：2021-12-23

申请号：PCT/US2021/037913

申请日：2021-06-17

Applicant: APPLIED MATERIALS, INC.

Inventor： HRUZEK, Dean C. ,  MERRY, Nir ,  RADKO, Marek ,  REUTER, Paul B. ,  SANSONI, Steven ,  KOSHTI, Sushant S. ,  MAZZOCCO, John Joseph ,  CHACIN, Juan

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677 ,  H01L21/67017 ,  H01L21/67098 ,  H01L21/6719 ,  H01L21/67739

Abstract: A substrate processing system includes an equipment front end module (EFEM) coupled to a vacuum-based mainframe, the EFEM including multiple interface openings. The system further includes a batch degas chamber attached to the EFEM at an interface opening of the multiple interface openings. The batch degas chamber includes a housing that is sealed to the interface opening of the EFEM. Within the housing is located a cassette configured to hold multiple substrates. A reactor chamber, attached to the housing, is to receive the cassette and perform an active degas process on the multiple substrates. The active degas process removes moisture and contaminants from surfaces of the multiple substrates. An exhaust line is attached to the reactor chamber to provide an exit for the moisture and contaminants.