Abstract:
Radiation sensitive resins for use as a top layer resist in a bilayer system for use in deep UV photolithography comprises derivatized copolymers having structural units (1), (2), (3) and (4) wherein n is 1 to 5, R is an alkyl group, R 1 a methyl or trimethylsiloxy, R 3 is hydrogen or methyl and R 2 and R 4 are each tert-butyl groups.
Abstract:
Thermally cured undercoat for use in lithography of a thermally cured composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator, wherein the hydroxyl containing polymer is a polymer comprising units m, n and o of the formula (I) wherein R is H or methyl; R is a substituted or unsubstituted C6-C14 aryl acrylate or C6-C14 aryl methacrylate group wherein the substituted groups may be phenyl, Cl-4 alkyl or C1-4 alkoxy; R is a hydroxyl functionalized Cl-C8 alkyl acrylate, methacrylate or C6-C14 aryl group, R is a C1-C10 linear or branched alkylene; p is an integer of from 1 to 5 with the proviso that there are no more than thirty carbon atoms in the [-R O-]p ; R is a Cl-C10 linear, branched or cyclic alkyl, substituted or unsubstituted C6-Cl4 aryl, or substituted or unsubstituted C7-Cl5 alicyclic hydrocarbon; and m is about 40 to 70, n is about 15 to 35 and o is about 15 to 25.