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公开(公告)号:WO2023285071A1
公开(公告)日:2023-01-19
申请号:PCT/EP2022/066586
申请日:2022-06-17
Applicant: ASML NETHERLANDS B.V.
Inventor: HSU, Duan-Fu, Stephen , JIANG, Xiaohui , JIA, Ningning , LIU, Gengxin
Abstract: Apparatuses, systems, and methods for selecting a subset of critical patterns from a plurality of patterns of a design layout. In some embodiments, the method comprising accessing diffraction order data based on the plurality of patterns that represent features to be formed on at least a portion of a wafer, the diffraction order data including a plurality of peaks corresponding to the plurality of patterns. The method also comprises identifying a subset of representative peaks from the plurality of peaks according to one or more grouping criteria, comprising identifying a first representative peak that covers another peak colinear with the first representative peak, wherein the first representative peak is a discrete peak having a frequency that is an integer multiple of frequency of another discrete peak. The method further comprises selecting the subset of critical patterns corresponding to the subset of representative peaks.
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公开(公告)号:WO2020108902A1
公开(公告)日:2020-06-04
申请号:PCT/EP2019/079562
申请日:2019-10-29
Applicant: ASML NETHERLANDS B.V.
Inventor: BISWAS, Roshni , HOWELL, Rafael C. , ZHANG, Cuiping , JIA, Ningning , LIU, Jingjing , ZHANG, Quan
Abstract: Described herein is a method for determining a patterning device pattern. The method includes obtaining (i) an initial patterning device pattern having at least one feature, and (ii) a desired feature size of the at least one feature, obtaining, based on a patterning process model, the initial patterning device pattern and a target pattern for a substrate, a difference value between a predicted pattern of the substrate image by the initial patterning device and the target pattern for the substrate, determining a penalty value related the manufacturability of the at least one feature, wherein the penalty value varies as a function of the size of the at least one feature, and determining the patterning device pattern based on the initial patterning device pattern and the desired feature size such that a sum of the difference value and the penalty value is reduced.
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