公开(公告)号：WO2014113323A1

公开(公告)日：2014-07-24

申请号：PCT/US2014/011297

申请日：2014-01-13

Applicant: BASF SE

Inventor： COLWELL, Harold ,  BALKE, Inga, Marie ,  DOMBROWSKI, Lee, Ann ,  LAIR, Richard, J. ,  LANGE, David, M. ,  WILMS, Axel

IPC: B29C45/14 ,  B29C44/08 ,  B29C44/12 ,  H05K3/28

CPC classification number: B29C44/355 ,  B29C44/1266 ,  B29C44/1271 ,  B29C45/0013 ,  B29C45/14639 ,  B29C70/26 ,  B29C70/72 ,  B29K2077/00 ,  B29K2509/00 ,  B29L2031/3425 ,  H05K1/185 ,  H05K3/284 ,  H05K5/0034 ,  H05K5/065 ,  H05K2201/0116 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: An encapsulated electronic assembly comprises an electronic component and a foamed thermoplastic shell disposed about the electronic component. The foamed thermoplastic shell is formed from a thermoplastic encapsulant comprising a thermoplastic resin and a filler and is foamed with a foaming agent. A method of encapsulating the electronic component to form the encapsulated electronic assembly is also provided. The method includes the steps of melting the thermoplastic encapsulant, foaming the thermoplastic encapsulant, and injection molding the foamed thermoplastic encapsulant about the electronic component to form the foamed thermoplastic shell.

Abstract translation: 封装的电子组件包括围绕电子部件设置的电子部件和发泡热塑性壳体。 发泡热塑性壳体由热塑性树脂和填料组成的热塑性密封剂形成，并用发泡剂发泡。 还提供了一种封装电子部件以形成封装的电子组件的方法。 该方法包括熔化热塑性密封剂，使热塑性密封剂发泡，以及围绕电子部件注射成型发泡热塑性密封剂以形成发泡热塑性壳体的步骤。