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公开(公告)号:WO2019132856A1
公开(公告)日:2019-07-04
申请号:PCT/US2017/068395
申请日:2017-12-26
Applicant: BEMIS COMPANY, INC.
Inventor: VENNERBERG, Daniel, C. , MICK, Rebecca, M. , MICHAUD, Ryan, A.
Abstract: An additive manufacturing method includes heating a glass having a glass transition temperature (T g ) of about 500°C or less, flowing the heated glass through a nozzle onto a platform, and moving the nozzle relative to the platform while the heated glass is flowed through the nozzle onto the platform to form an object on the platform.
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公开(公告)号:WO2018182721A1
公开(公告)日:2018-10-04
申请号:PCT/US2017/025518
申请日:2017-03-31
Applicant: BEMIS COMPANY, INC.
IPC: C09D161/28 , B32B27/38 , C08G59/14
Abstract: A transparent film includes a first portion configured to form at least a portion of a first compartment of a multi-component package. The film also includes & second portion, con figured to form at least a portion of a second compartment of the multi- component package. The film further includes a barrier coating disposed on the first portion to reduce permeation of a migratory species through the first portion relative to the second portion.
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公开(公告)号:WO2019054982A1
公开(公告)日:2019-03-21
申请号:PCT/US2017/051060
申请日:2017-09-12
Applicant: BEMIS COMPANY, INC.
Inventor: MICHAUD, Ryan, A. , MICK, Rebecca, M. , VENNERBERG, Daniel, C. , OSBORN, Christopher, L. , HAEDT, Edward, L.
Abstract: Multilayered molded articles comprising a glass layer interposed between first and second non-glass layers are described. These molded articles provide enhanced oxygen and moisture barrier protection to stored contents and are useful in medical, pharmaceutical, food, and research applications as containers and packaging materials.
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4.
公开(公告)号:WO2018118021A1
公开(公告)日:2018-06-28
申请号:PCT/US2016/067747
申请日:2016-12-20
Applicant: BEMIS COMPANY, INC.
Inventor: VENNERBERG, Daniel, C. , MICHAUD, Ryan, A.
Abstract: The present invention is directed to thermoformed packaging articles comprising a coextruded fiim having alternating individual iayers of glass and plastic. These thermoformed packaging articles may be used for packaging oxygen- and/or moisture sensitive foods and pharmaceutica!/medicai/dentai products.
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