公开(公告)号：WO1997037805A1

公开(公告)日：1997-10-16

申请号：PCT/US1997005770

申请日：1997-04-08

Applicant: CERIDIAN CORPORATION

Inventor： CERIDIAN CORPORATION ,  PAI, Deepak, Keshav ,  LUND, Lowell, Dennis

IPC: B23K03/00

CPC classification number: H05K13/0486 ,  B23K1/018 ,  B23K2101/40 ,  H01L24/799 ,  H01L24/98

Abstract: A method of removing solder (60) from an area grid array pad (52) by applying a wire mesh (14) to a conductive surface (54) of the area grid array (52) that is covered with solder (60). Heat is applied to the wire mesh (14) and the conductive surface (54) of the area grid array (52) so that the solder (60) flows from the conductive surface (54) onto the wire mesh (14). The wire mesh (14) is removed from the conductive surface (54) thereby removing all solder (60) from the conductive surface (54) of the area grid array (52).

Abstract translation: 通过将金属丝网（14）施加到被焊料（60）覆盖的区域栅格阵列（52）的导电表面（54）上，从区域栅格阵列焊盘（52）去除焊料（60）的方法。 对金属丝网（14）和区域栅格阵列（52）的导电表面（54）施加热量，使得焊料（60）从导电表面（54）流到金属丝网（14）上。 从导电表面（54）去除金属丝网（14），从而从区域格栅阵列（52）的导电表面（54）上除去所有焊料（60）。