TREATMENT OF PAIN WITH GAP JUNCTION MODULATION COMPOUNDS
    1.
    发明申请
    TREATMENT OF PAIN WITH GAP JUNCTION MODULATION COMPOUNDS 审中-公开
    用缝隙调节化合物治疗疼痛

    公开(公告)号:WO2009148613A1

    公开(公告)日:2009-12-10

    申请号:PCT/US2009/003408

    申请日:2009-06-04

    IPC分类号: C12N15/11 A61P25/00

    摘要: The present invention relates to delivery, including transdermal delivery, of a therapeutically effective amount of a compound useful for modulating gap junction formation and function, including an oligonucleotide for reducing gap junction formation and function, and methods and compositions for treating a subject suffering from pain associated with a disease, disorder or condition and associated with pain, including but not limited to muscle pain, ligament pain, tendon pain, joint pain and post-operative pain.

    摘要翻译: 本发明涉及治疗有效量的用于调节间隙连接形成和功能的化合物的递送(包括透皮递送),包括用于减少间隙连接形成和功能的寡核苷酸,以及用于治疗患有疼痛的受试者的方法和组合物 与疾病,病症或病症相关并且与疼痛相关,包括但不限于肌肉疼痛,韧带疼痛,肌腱疼痛,关节疼痛和手术后疼痛。