公开(公告)号：WO1981003087A1

公开(公告)日：1981-10-29

申请号：PCT/US1981000543

申请日：1981-04-27

Applicant: COMMUNICATIONS SATELLITE CORP

Inventor： COMMUNICATIONS SATELLITE CORP ,  LEE Y

IPC: H01P01/30

CPC classification number: H01P1/30 ,  H01P9/006

Abstract: A temperature-stable microwave integrated circuit (MIC) delay line (10) employs at least two cascade connected dielectric substrates (12, 14), for example, a high dielectric barium tetratitanate (Ba- Ti u0 u) ceramic microstrip (22), and a short sapphire single crystal Al u0 u microstrip section (26). Temperature changes in the transmission phase are compensated for by selecting the substrate materials such that the positive transmission phase temperature coefficient of one substrate is effectively cancelled out by the negative transmission phase temperature coefficient of the other sub-strate. In this manner, the transmission delay temperature coefficient of the composite delay line may be reduced to a value of 0.6(+/- 0.3) x 10- 6 parts per degree C. at 14 GHz over the temperature range of 20 degrees C. +/- 30 degrees C.

Abstract translation: 温度稳定的微波集成电路（MIC）延迟线（10）使用至少两个级联的电介质基板（12,14），例如高介电四钛酸钡（Ba-Ti u u u） 陶瓷微带线（22）和短蓝宝石单晶Aluu U微带部分（26）。 通过选择基板材料来补偿透射相位的温度变化，使得一个基板的正透射相位温度系数被其他子图的负透射相位温度系数有效抵消。 以这种方式，复合延迟线的传输延迟温度系数可以在20摄氏度的温度范围内降低到14GHz的0.6（+/- 0.3）×10 -6度/℃的值。+ / - 30摄氏度