Abstract:
A tunable electromagnetic delay line, comprising a first conductor with a first main direction of extension, said first conductor being arranged on top of a non-conducting substrate, characterized in that the delay line additionally comprises a layer of a ferroelectric material with first and second main surfaces, which layer separates the first conductor and the substrate, and in that the delay line also comprises a second conductor with a second main direction of extension, with the first and second main directions of extensions essentially coinciding with each other, and with the first and second conductors being each other's mirror image with respect to an imagined line in the center of the delay line along said first and second main directions of extension, said tuning being accomplished by applying a voltage between said first and second conductors.
Abstract:
A design structure, structure, and method for providing an on-chip variable delay transmission line with a fixed characteristic impedance. A transmission line structure includes a signal line (50) ( e.g. S), a first ground return structure (55) ( e.g. G1) that causes a first delay (t1) and a first characteristic impedance (ZoI) in the transmission line structure, and a second ground return structure (75) ( e.g. G2) that causes a second delay (t2) and a second characteristic impedance (Zo2) in the transmission line structure. The first delay (t1) is different from the second delay (t2), and the first characteristic impedance (Zo1) is substantially the same as the second characteristic impedance (Zo2).
Abstract:
A superconducting delay line utilizes a meandering conductor on a substrate, a thin dielectric coating and a ground plane adjacent the conductor having portions selectively removed so as to control the impedance of the device. In the preferred embodiment, the superconducting microwave delay line is constructed having an epitaxial superconducting conductor and a portion of the ground plane coplanar with the conductor, both formed on the substrate, with the remainder of the ground plane formed by interconnections between the coplanar ground plane. Superconducting epitaxial films may be patterned to provide the conductor and coplanar portions of the ground plane. Metal interconnects disposed on the coplanar portions of the ground plane bridge over the conductor, and the impedance of the device is adjusted by varying the coverage of the conductor by the interconnects. In another embodiment, a single ground plane has sections removed adjacent the conductor to adjust the impedance to substantially 50 ohms. A superconducting epitaxial film is patterned to form a conductor, a dielectric insulator covers the conductor and substrate and a ground plane having removed portions is disposed above the insulator. Superconductive delay lines of this invention may have a 20 GHz bandwidth and a Q exceeding 1,800.
Abstract:
An antenna array includes a plurality of antenna elements. The antenna elements include layers of dielectric material; an antenna inlaid in a top layer of the dielectric material so a surface of the antenna is substantially parallel to an outer surface of the top layer of dielectric material; and a conductive staircase balun, coupled to the antenna, and embedded in one or more layers of the dielectric material. The antenna array is operative to receive signals from V to W frequency band transmissions generated by a heat source.
Abstract:
In the preferred embodiment, a superconductive microwave delay line is constructed having an epitaxial superconducting conductor (50) and a portion of the ground plane (54) coplanar with the conductor, both formed on the substrate, with the remainder of the ground plane formed by interconnections (56) between the coplanar ground plane (54). Superconducting epitaxial films may be patterned to provide the conductor and coplanar portions of the ground plane. Metal interconnects (56) disposed on the coplanar portions of the ground plane bridge over the conductor (50) and the impedance of the device is adjusted by varying the coverage of the conductor by the interconnects.
Abstract:
A temperature-stable microwave integrated circuit (MIC) delay line (10) employs at least two cascade connected dielectric substrates (12, 14), for example, a high dielectric barium tetratitanate (Ba- Ti u0 u) ceramic microstrip (22), and a short sapphire single crystal Al u0 u microstrip section (26). Temperature changes in the transmission phase are compensated for by selecting the substrate materials such that the positive transmission phase temperature coefficient of one substrate is effectively cancelled out by the negative transmission phase temperature coefficient of the other sub-strate. In this manner, the transmission delay temperature coefficient of the composite delay line may be reduced to a value of 0.6(+/- 0.3) x 10- 6 parts per degree C. at 14 GHz over the temperature range of 20 degrees C. +/- 30 degrees C.
Abstract translation:温度稳定的微波集成电路(MIC)延迟线(10)使用至少两个级联的电介质基板(12,14),例如高介电四钛酸钡(Ba-Ti u u u) 陶瓷微带线(22)和短蓝宝石单晶Aluu U微带部分(26)。 通过选择基板材料来补偿透射相位的温度变化,使得一个基板的正透射相位温度系数被其他子图的负透射相位温度系数有效抵消。 以这种方式,复合延迟线的传输延迟温度系数可以在20摄氏度的温度范围内降低到14GHz的0.6(+/- 0.3)×10 -6度/℃的值。+ / - 30摄氏度