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    DECORATED GLASS HAVING A PRINTED INK LAYER
    1.
    发明申请
    DECORATED GLASS HAVING A PRINTED INK LAYER 审中-公开

    公开(公告)号：WO2020205519A1

    公开(公告)日：2020-10-08

    申请号：PCT/US2020/025223

    申请日：2020-03-27

    Applicant: CORNING INCORPORATED

    Inventor： LESUFFLEUR, Antoine Daniel ,  OUYANG, Xu ,  SUN, Yawei

    IPC: C03C17/22

    Abstract: Embodiments of a decorated glass are provided. The decorated glass includes a transparent substrate having a first major surface and a second major surface. The second major surface is opposite the first major surface. The decorated glass also includes a black ink layer disposed on the second major surface in a display region. The black ink layer has a transmission coefficient of between 0.2 and 0.85 with respect to incident light having a wavelength of 400 nm to 700 nm. The decorated glass has 2% or less of sparkle when measured from the first major surface via pixel power deviation reference (PPDr).

    SUBSTRATE SUPPORTS FOR A SPUTTERING DEVICE
    3.
    发明申请
    SUBSTRATE SUPPORTS FOR A SPUTTERING DEVICE 审中-公开

    公开(公告)号：WO2018148243A2

    公开(公告)日：2018-08-16

    申请号：PCT/US2018/017166

    申请日：2018-02-07

    Applicant: CORNING INCORPORATED

    Inventor： OUYANG, Xu ,  PAN, Yale G.

    IPC: C23C14/34

    Abstract: A sputtering device and method including a chamber, a target disposed within the chamber, and a substrate support including at least a portion consisting essentially of a non-aluminous and non-magnetic metallic material disposed within the chamber. The substrate support may include a carrier and a fixture for holding a substrate. In some embodiments, at least the target-facing surface of the carrier consists essentially of a non-aluminous and non-magnetic metallic material. In some embodiments, the fixture consists essentially of a non-aluminous and non-magnetic metallic material. The sputtering device may be drum sputtering device. The sputtering method may be a magnetron sputtering method.

    DEADFRONT CONFIGURED FOR COLOR MATCHING
    4.
    发明申请
    DEADFRONT CONFIGURED FOR COLOR MATCHING 审中-公开

    公开(公告)号：WO2020014064A1

    公开(公告)日：2020-01-16

    申请号：PCT/US2019/040485

    申请日：2019-07-03

    Applicant: CORNING INCORPORATED

    Inventor： LESUFFLEUR, Antoine D. ,  OUYANG, Xu ,  SUN, Yawei

    IPC: C03C17/34 ,  B60Q3/18

    Abstract: Embodiments of a deadfront configured to hide a display when the display is not active are provided. The deadfront includes a substrate having a first major surface and a second major surface. The second major surface is opposite the first major surface. The deadfront also includes a neutral density filter disposed on the second major surface of the transparent substrate and an ink layer disposed on the neutral density filter. The deadfront defines at least one display region in which the deadfront transmits at least 60% of incident light and at least one non-display region in which the deadfront transmits at most 5% of incident light. A contrast sensitivity between each of the at least one display region and each of the at least one non-display region is at least 15 when the display is not active.

    COATED ARTICLES AND METHODS OF MAKING
    6.
    发明申请
    COATED ARTICLES AND METHODS OF MAKING 审中-公开

    公开(公告)号：WO2023086238A1

    公开(公告)日：2023-05-19

    申请号：PCT/US2022/048546

    申请日：2022-11-01

    Applicant: CORNING INCORPORATED

    Inventor： CHEN, Haixing ,  OUYANG, Xu ,  SUN, Yawei

    IPC: C03C3/097 ,  C03C17/00 ,  C03C17/22 ,  C03C17/34

    Abstract: Coated articles comprise a coating disposed on a substrate. The coating comprises a surface having a contact angle with deionized water of 90° or more. A refractive index of the coating is less than a refractive index of the substrate. The coating comprises interpenetrating networks of hydrogenated amorphous carbon and amorphous silicon oxide. Methods of forming coated articles can comprise disposing a coating over a substrate using plasma-enhanced chemical vapor deposition or physical vapor deposition of a precursor. The precursor comprises hydrogen, carbon, and silicon and one or more of oxygen or nitrogen. The coating comprises a surface having a contact angle with deionized water of 90° or more. A refractive index of the coating is less than a refractive index of the substrate. The coating comprises interpenetrating networks of hydrogenated amorphous carbon and at least one of amorphous silicon oxide or amorphous silicon nitride.

    DURABLE ANTI-REFLECTIVE ARTICLES
    8.
    发明申请
    DURABLE ANTI-REFLECTIVE ARTICLES 审中-公开
    耐用的反思性文章

    公开(公告)号：WO2015175390A1

    公开(公告)日：2015-11-19

    申请号：PCT/US2015/030111

    申请日：2015-05-11

    Applicant: CORNING INCORPORATED

    Inventor： AMIN, Jaymin ,  HART, Shandon Dee ,  KOCH, Karl William III ,  NULL, Eric Louis ,  OUYANG, Xu ,  PAULSON, Charles Andrew ,  PRICE, James Joseph

    IPC: C03C17/34 ,  G02B1/115

    CPC classification number: C09D5/006 ,  C03C17/3417 ,  C03C17/3435 ,  C03C21/002 ,  C03C2217/734 ,  C03C2217/78 ,  G02B1/115 ,  Y10T428/24355 ,  Y10T428/265

    Abstract: Embodiments of durable, anti-reflective articles are described. In one or more embodiments, the article includes a substrate and an anti-reflective coating disposed on the major surface. The article exhibits an average light transmittance of about 94% or greater over an optical wavelength regime and/or an average light reflectance of about 2% or less over the optical wavelength regime, as measured from an anti-reflective surface. In some embodiments, the article exhibits a maximum hardness of about 8 GPa or greater as measured by a Berkovich Indenter Hardness Test along an indentation depth of about 50 nm or greater and a b* value, in reflectance, in the range from about -5 to about 1 as measured on the anti- reflective surface only at all incidence illumination angles in the range from about 0 degrees to about 60 degrees under an International Commission on Illumination illuminant.

    Abstract translation: 描述了耐用的抗反射制品的实施例。 在一个或多个实施例中，制品包括设置在主表面上的基底和抗反射涂层。 从抗反射表面测量，该物品在光学波长方面平均透光率为约94％或更大，和/或比光学波长范围大约2％或更小的平均光反射率。 在一些实施方案中，通过Berkovich压头硬度测试，沿着约50nm或更大的压痕深度和反射率的ab *值测量，制品的最大硬度为约8GPa或更大，在约-5至 仅在国际照明照明委员会的约0度至约60度的范围内的所有入射照射角度下在抗反射表面上测量的约1。

    CARRIER WAFERS AND METHODS OF FORMING CARRIER WAFERS
    9.
    发明申请
    CARRIER WAFERS AND METHODS OF FORMING CARRIER WAFERS 审中-公开

    公开(公告)号：WO2020068629A1

    公开(公告)日：2020-04-02

    申请号：PCT/US2019/052369

    申请日：2019-09-23

    Applicant: CORNING INCORPORATED

    Inventor： KIM, Lance Changyong ,  LU, Fei ,  OUYANG, Xu ,  PAN, Ye Guang

    IPC: B24B37/08 ,  B24B37/025 ,  B24B7/22

    Abstract: A method of forming a carrier wafer includes the steps of: lapping a first surface and a second surface of the carrier wafer such that the carrier wafer is substantially flat, the carrier wafer comprising a glass, glass-ceramic or ceramic material, wherein the carrier wafer has a diameter of from 250 mm to 450 mm and a thickness of from 0.5 mm to 2 mm after lapping; and polishing the first surface of the carrier wafer with at least one of a differential pressure, a differential speed or a differential time between a center portion and an edge portion of the carrier wafer such that the first surface has a convex or concave shape.

    HERMETICALLY SEALED PACKAGE
    10.
    发明申请
    HERMETICALLY SEALED PACKAGE 审中-公开

    公开(公告)号：WO2020033193A1

    公开(公告)日：2020-02-13

    申请号：PCT/US2019/044297

    申请日：2019-07-31

    Applicant: CORNING INCORPORATED

    Inventor： HUANG, Ming-Huang ,  KIM, Hoon ,  OUYANG, Xu

    IPC: B81C1/00 ,  B81B7/00

    Abstract: An electrical component package includes a glass substrate, an interposer panel positioned on the glass substrate, the interposer panel comprising a device cavity, a wafer positioned on the interposer panel such that the device cavity is enclosed by the glass substrate, the interposer panel, and the wafer. The electrical component package further includes a metal seed layer disposed between the interposer panel and the wafer, and a dielectric coating. The dielectric coating hermetically seals the interposer panel to the glass substrate, the interposer panel to the metal seed layer and the wafer, and the interposer panel hermetically seals the metal seed layer to the glass substrate such that the device cavity is hermetically sealed from ambient atmosphere.

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