公开(公告)号：WO2016056788A3

公开(公告)日：2017-04-27

申请号：PCT/KR2015010420

申请日：2015-10-02

Applicant: CORNING PREC MATERIALS CO LTD

Inventor： KIM JOON SOO ,  KIM JHEE MANN ,  LEE SUNG CHAN ,  MOON HYUNG SOO ,  OH JUNG KEUN ,  LEE JI HOON ,  CHOI JAE YOUNG

IPC: C03C15/00 ,  C09K13/04

CPC classification number: C03C15/00

Abstract: The present invention relates to a glass substrate manufacturing method and, more specifically, to a glass substrate manufacturing method capable of increasing a bonding force with an electroless plating layer to be plated on the surface. To this end, the present invention provides a glass substrate manufacturing method for increasing a bonding force with an electroless plating layer, comprising: a first etching step of immersing a glass substrate into a hydrofluoric acid (HF) solution; and a second etching step of forming a three-dimensional network structure in the inner direction on the surface of the glass substrate on which the electroless plating layer is to be plated, by immersing, into a saturated silica solution, the glass substrate etched through the first etching step.

Abstract translation: 玻璃基板的制造方法技术领域本发明涉及一种玻璃基板的制造方法，更详细地说，涉及一种能够提高与被镀覆在表面上的化学镀层的接合力的玻璃基板的制造方法。 为此，本发明提供了一种用于增加与无电镀层的结合力的玻璃基板制造方法，包括：第一蚀刻步骤，将玻璃基板浸入氢氟酸（HF）溶液中; 以及第二蚀刻步骤，通过将玻璃基板浸渍在饱和二氧化硅溶液中，从而在玻璃基板的待镀敷化学镀层的表面上沿内部方向形成三维网状结构， 第一蚀刻步骤。