摘要:
A method of removing residue containing an insoluble lithium phosphate compound from a surface includes soaking the surface in a cleaning aqueous solution having a pH less than 5 for a select time period, whereby the insoluble lithium phosphate compound is converted into soluble lithium hydrogen phosphate and the soluble lithium hydrogen phosphate is dissolved in the cleaning aqueous solution. The method includes rinsing the surface with deionized water. The surface is substantially free of the insoluble lithium phosphate compound after the rinsing.
摘要:
The described embodiments relate generally to a micro-perforated panel systems and methods for noise abatement and method of making a micro-perforated panel system. In particular, embodiments relate to glass micro-perforated panel systems and methods for their construction.
摘要:
L'objet décoratif selon l'invention comprend une glace supérieure (2), une glace inférieure (3), un motif en creux (8) formé dans la glace inférieure (3) en face de la glace supérieure (2), un liquide (10) remplissant le motif en creux (8), l'indice de réfraction du liquide (10) étant égal à celui de la glace inférieure (3) ou différant de celui de la glace inférieure (3) d'au plus 10%, et des éléments solides (11) mobiles dans le liquide (10). (Figure 1)
摘要翻译:
解对象;根据本发明coratif包括冰SUPé更高(2),下é冰;更高(3),中空图案(8)形式Dé 在冰INF(3)在冰SUP的前éé更高更高(2),填充凹陷(8),液体(10)Ré馏分的索引的模式E作为液体(10) à 该INFé冰;制冰INF的更高(3)或差异é咆哮é更高(3)的至多10%,和e L E固体元件(11)在可动液体(10) 。 (图1) p>
摘要:
The present invention relates to a glass substrate manufacturing method and, more specifically, to a glass substrate manufacturing method capable of increasing a bonding force with an electroless plating layer to be plated on the surface. To this end, the present invention provides a glass substrate manufacturing method for increasing a bonding force with an electroless plating layer, comprising: a first etching step of immersing a glass substrate into a hydrofluoric acid (HF) solution; and a second etching step of forming a three-dimensional network structure in the inner direction on the surface of the glass substrate on which the electroless plating layer is to be plated, by immersing, into a saturated silica solution, the glass substrate etched through the first etching step.
摘要:
A glass sensor substrate including metallizable through vias and related process is provided. The glass substrate has a first major surface, a second major surface and an average thickness of greater than 0.3 mm. A plurality of etch paths are created through the glass substrate by directing a laser at the substrate in a predetermined pattern. A plurality of through vias through the glass substrate are etched along the etch paths using a hydroxide based etching material. The hydroxide based etching material highly preferentially etches the substrate along the etch path. Each of the plurality of through vias is long compared to their diameter for example such that a ratio of the thickness of the glass substrate to a maximum diameter of each of the through vias is greater than (8) to (1).