公开(公告)号：WO2013130915A1

公开(公告)日：2013-09-06

申请号：PCT/US2013/028469

申请日：2013-02-28

Applicant: DATA I/O CORPORATION

Inventor： SANDHU, Jaswant ,  FRANCIS, Robert S.

IPC: H01L23/32 ,  H01R33/76

CPC classification number: H01R12/714 ,  H01R12/523 ,  H01R12/57 ,  H01R12/7076 ,  H01R23/72 ,  H01R2201/20 ,  H05K7/1053 ,  Y10T29/49208

Abstract: A method of manufacture of an integrated circuit socket system includes: forming a retainer plate having a pinhole extending through the retainer plate; forming a base plate having a connector hole extending through the base plate, the connector hole aligned with the pinhole; inserting a compressible pin having a lower probe end through the connector hole and the pinhole below the connector hole, a portion of the compressible pin in the base plate; forming a device plate having a cavity hole extending through the device plate and aligned with the an upper probe end of the compressible pin exposed in the cavity hole; and mounting a removable fastener through the device plate, the base plate, and into the retainer plate, the device plate over the base plate directly on the retainer plate and attached to one another by the removable fastener.

Abstract translation: 一种集成电路插座系统的制造方法，包括：形成具有延伸穿过保持板的针孔的保持板; 形成具有延伸穿过所述基板的连接器孔的基板，所述连接器孔与所述针孔对齐; 将具有较低探针端的可压缩销插入连接器孔和连接器孔下方的针孔，基座板中的可压缩销的一部分; 形成具有延伸穿过所述装置板并且暴露在所述空腔孔中的所述可压缩销的上探针端的空腔孔的装置板; 以及将可拆卸的紧固件安装在所述装置板，所述基板上并且安装到所述保持板中，所述装置板在所述基板上直接位于所述保持板上并且通过所述可移除的紧固件彼此附接。