Abstract:
A curable silicone composition comprising: (A) a diorganosiloxane represented by the following general formula: A-R 2 -(R 1 2 SiO) n R 1 2 Si-R 2 -A {wherein R 1 represents the same or different optionally substituted univalent hydrocarbon groups that do not have unsaturated aliphatic bonds; R 2 represents bivalent organic groups; A designates siloxane residual radicals represented by the following average unit formula: (XR 1 2 SiO 1/2 ) a (SiO 4/2 ) b (wherein R 1 designates the previously mentioned group; X designates a single bond, hydrogen atom, the previously mentioned group that is designated by R 1 , an epoxy-containing alkyl group, or an alkoxysilylalkyl group; at least one X in one molecule is a single bond; at least two X's are epoxy-containing alkyl groups; "a" is a positive number, "b" is a positive number; and "a/b" is a positive number within the range of 0.2 to 4), and "n" is an integer which is equal to or greater than 1}; and (B) a curing agent for an epoxy resin, is characterized by excellent handlability and curability and that is suitable for curing into a cured body that has excellent flexibility and adhesive characteristics; to provide a highly reliable electronic device.
Abstract:
A curable organopolysiloxane composition comprising: (A) an novel organopolysiloxane represented by the following average structural formula: R 1 a SiO (4-a)/2 {wherein R 1 represents a substituted or non-substituted monovalent hydrocarbon group, an alkoxy group, a hydroxyl group, or an organopolysiloxane residue of the following general formula: -X-(SiR 2 2 O) m SiR 2 3 (wherein R 2 are the same or different, substituted or unsubstituted monovalent hydrocarbon groups; X represents oxygen atoms or a bivalent hydrocarbon group; and 'm' is an integer equal to or greater than 1); however, at least one R 1 in one molecule is the aforementioned organopolysiloxane residue, at least one R 1 is a monovalent hydrocarbon group having aliphatic carbon-carbon double bonds, and 'a' is a positive number that satisfies the following condition: 0
Abstract:
A curable silicone composition comprising: (A) a liquid organopolysiloxane having in one molecule at least two epoxy groups; (B) a compound containing groups react to the epoxy groups; (C) a thermally conductive filler; and (D) a silicone powder, preferably, an epoxy-containing silicone powder; possesses excellent handleability and workability in combination with low viscosity and that, when cured, forms a cured body of excellent elasticity, adhesiveness, and thermal conductivity.
Abstract:
A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for an epoxy resin; (C) a thermally conductive metal powder; and (D) a thermally conductive nonmetal powder; exhibits low viscosity, excellent handleability and curability and, when cured, forms a cured body of flexibility, low specific gravity, and excellent thermal conductivity. An electronic component sealed or adhesively bonded with use of a cured body obtained by curing the aforementioned composition provides high reliability.
Abstract:
An adhesion-promoting agent represented by the following average formula: R 1 a SiO (4-a/2 (where R 1 is a group selected from an optionally substituted alkyl group with 1 to 10 carbon atoms, an alkenyl group with 2 to 20 carbon atoms, an aryl group with 6 to 20 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, or an epoxy-containing organic group; however, in one molecule, the content of the alkenyl groups should constitute at least 5 mole % of all groups designated by R 1 ; the content of the aryl groups should constitute at least 5 mole % of all groups designated by R 1 ; the content of the alkoxy groups should constitute at least 5 mole % of all groups designated by R 1 ; the content of the epoxy-containing organic groups should constitute at least 5 mole % of all groups designated by R 1 ; and "a" is a number that satisfies the following condition: 1.0 ≤ a
Abstract:
A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si-H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.
Abstract:
An organotrisiloxane represented by the following general formula (I), wherein R 1 and R 2 may be the same or different and designate optionally substituted univalent hydrocarbon groups that do not have aliphatically unsaturated bonds, with the proviso that at least one of R 1 or R 2 is an aryl group, and R 3 designates an organic group that contains a phenolic hydroxyl group, is a novel compound that possesses good reactivity and excellent compatibility and dispersibility with respect to the curable resins, such as epoxy resin.
Abstract:
The present invention relates to a method of producing a silicone powder- containing oil composition, characterized by removing the water from a water-based emulsion of a silicone powder- containing oil composition while stirring this emulsion under reduced pressure with a stirring apparatus that has at least a stirring means that rotates at low speed along the inner wall of a container and a stirring means that rotates at high speed in the interior of the container.
Abstract:
This invention relates to a silicone oil emulsion that contains cross-linked silicone particles in drops of silicone oil which have an average particle diameter of 0.1 to 500 μm and are dispersed in water, wherein the silicone oil contains epoxy groups, acryl groups, methacryl groups, silicon-bonded alkoxy groups, or silicon-bonded hydroxyl groups but is free of silicon-bonded hydrogen atoms and alkenyl groups, said cross-linked silicone particles is formed by a hydrosilation reaction. Furthermore, this invention also relates to a silicone oil composition obtained by removing water from said emulsion.
Abstract:
A curable liquid epoxy resin composition comprising: (I) a liquid epoxy resin; (II) an acid anhydride; (III) a diorganosiloxane represented by the following general formula: A-R 2 -(R 1 2#191SiO)?n#191R 1 ?2#191Si-R 2?-A {where R 1 designates identical or different, substituted or unsubstituted univalent hydrocarbon groups, which are free of aliphatic unsaturated bonds; R 2 designates bivalent organic groups; "A" represents a siloxane residue radical expressed by the following average unit formula: (XR 1 ?2#191SiO?1/2#191)?a#191 (SiO?4/2#191)?b#191 (where R 1 is the same as defined above, X designates a single bond, a hydrogen atom, a group designated by R 1 , an epoxy-containing alkyl group, or an alkoxysilylalkyl group; however, in one molecule at least one X should be represented by a single bond, and at least two groups designated by X should be represented by epoxy-containing alkyl groups; "a" is a positive number; "b" is a positive number; and a/b is a number ranging from 0.2 to 4); and "n" is an integer equal to or greater than 1}; and (IV) an inorganic filler, possesses excellent handleability and workability and that, when cured, forms a cured product of excellent adhesiveness in combination with low modulus of elasticity.