HIGH REFRACTIVE INDEX PHOTORESIST COMPOSITION

    公开(公告)号:WO2023064023A1

    公开(公告)日:2023-04-20

    申请号:PCT/US2022/039032

    申请日:2022-08-01

    Abstract: A composition contains a photocurable resin that has a weight- average molecular weight of 3000-50000 Daltons, a glass transition temperature of at least 100 degrees Celsius and contains the following siloxane units: 50-80 mole-percent (HSiC>3/2), 10 to 30 mole-percent (R*SiC>3/2), 10 to 40 mole-percent (Ar*SiC>3/2), and 20.0 mole-percent or less of Si-OZ content, where mole-percent values are relative to moles of silicon atoms in the photocurable resin, R* is a photocurable group, Ar* in each occurrence is selected from a group of halogen-substituted aryl groups and polyaryl groups; Z in each occurrence is selected from hydrogen and alkyl groups, and subscripts x and y are independently in each occurrence either one or 2.

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