ENCAPSULATION USING MICROCELLULAR FOAMED MATERIALS
    2.
    发明申请
    ENCAPSULATION USING MICROCELLULAR FOAMED MATERIALS 审中-公开
    使用微孔泡沫材料进行包埋

    公开(公告)号:WO0197584A3

    公开(公告)日:2002-04-18

    申请号:PCT/US0119190

    申请日:2001-06-14

    Applicant: DU PONT

    Inventor: BOYER THOMAS D

    Abstract: Injection molding encapsulation processes for packaging an object or objects in microcellular foamed material, comprising the steps of providing a mold having a mold cavity, positioning at least one object in the mold cavity, providing a packaging material, introducing a fluid into the packaging material under conditions sufficient to produce a supercritical fluid-packaging material solution, introducing the solution into the mold cavity, and converting the solution into a microcellular foamed material. Such processes are advantageously employed in encapsulation of electronic or electrical components. Packaged objects produced therefrom may be completely or partially encapsulated.

    Abstract translation: 用于在微细泡沫材料中包装物体的注射成型封装方法,包括以下步骤:提供具有模腔的模具,将至少一个物体定位在模腔中,提供包装材料,将流体引入到包装材料下面 足以产生超临界流体包装材料溶液的条件,将溶液引入模腔,并将溶液转化成微孔泡沫材料。 这种方法有利地用于封装电子或电气部件。 由此产生的包装物体可以完全或部分包封。

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