公开(公告)号：WO2013054327A2

公开(公告)日：2013-04-18

申请号：PCT/IL2012/050388

申请日：2012-09-24

Applicant: ELTA SYSTEMS LTD.

Inventor： MOYAL, David ,  ELBAZ, Haviv

IPC: H05K7/20

CPC classification number: H05K7/20545

Abstract: A heat sink device configured for conduction cooling of at least one heat generating component that is mounted to a first face of a substrate is disclosed. The heat sink device includes a heat transfer body configured for being mounted with respect to the substrate and at least one heat transfer unit that includes a heat transfer element configured for providing a heat transfer path between the heat generating component and the heat transfer body. The heat transfer unit includes a first thermal contact surface configured for providing thermal contact between the heat transfer unit and the heat generating component in operation of the heat sink device. The heat transfer element includes a second thermal contact surface different the first thermal contact surface and in thermal communication with the first thermal contact surface. The heat transfer element is movably mounted with respect to the heat transfer body for selective displacement in at least a first direction with respect to the heat transfer body while concurrently providing thermal contact between the second thermal contact surface and the heat transfer body. Also disclosed are a corresponding conduction cooled module and a corresponding method for assembling a conduction cooled module.

Abstract translation: 公开了一种散热器装置，其被配置用于传导冷却安装到基板的第一面的至少一个发热部件。 散热装置包括构造成相对于基板安装的传热体和包括传热元件的至少一个传热单元，传热元件构造成用于在发热部件和传热体之间提供传热路径。 传热单元包括第一热接触表面，该第一热接触表面被配置为在散热器装置的操作中提供传热单元与发热部件之间的热接触。 传热元件包括与第一热接触表面不同且与第一热接触表面热连通的第二热接触表面。 传热元件相对于传热体可移动地安装，用于相对于传热体在至少第一方向上选择性移位，同时在第二热接触面和传热体之间提供热接触。 还公开了相应的传导冷却模块和用于组装传导冷却模块的相应方法。