公开(公告)号：WO2013152969A2

公开(公告)日：2013-10-17

申请号：PCT/EP2013056894

申请日：2013-04-02

Applicant: TYCO ELECTRONICS RAYCHEM BVBA

Inventor： THIJS DANNY GHISLAIN ,  BLEUS HEIDI

IPC: H05K7/20

CPC classification number: F28F1/006 ,  F28F1/00 ,  F28F9/26 ,  F28F2280/00 ,  H05K7/2039 ,  H05K7/20545 ,  H05K7/20554 ,  H05K7/20572 ,  Y10T29/4935

Abstract: The present disclosure relates to a heat dissipation device (16) for telecommunications equipment. The device (16) includes an enclosed conduit (48) extending between an P open first end (50) and an open second end (52), wherein the open first end (50) is configured to be coupled to a heat outlet (44) of a telecommunications fixture (12) and the open second end (52) is configured to be coupled to a heat outlet (38) of a telecommunications device (14) mounted within the telecommunications fixture (12) so as to provide a heat transfer path between the heat outlets (38, 44) of the telecommunications device (14) and the telecommunications fixture (12). An outer dimension (54) of the open second end (52) is adjustable in size for corresponding to a variety of different sized heat outlets (38) of different telecommunications devices (14) that can be mounted within the telecommunications fixture (12). The enclosed conduit (48) is defined by a flexible body (56) for maintaining the heat transfer path between the heat outlet (44) of the telecommunications fixture (12) and a variety of different heat outlet (38) locations of different telecommunications devices (14) that can be mounted within the telecommunications fixture (12).

Abstract translation: 本公开涉及用于电信设备的散热装置（16）。 装置（16）包括在P开放第一端（50）和开放第二端（52）之间延伸的封闭导管（48），其中开放第一端（50）构造成耦合到热出口 ），并且开放的第二端（52）被配置为耦合到安装在电信固定装置（12）内的电信装置（14）的热出口（38），以便提供热传递 电信装置（14）的热出口（38,44）与电信装置（12）之间的路径。 开放的第二端（52）的外部尺寸（54）的大小可调节，以对应于可安装在电信装置（12）内的不同电信装置（14）的各种不同尺寸的热量出口（38）。 封闭的导管（48）由柔性主体（56）限定，用于保持电信器具（12）的热出口（44）与不同电信装置（12）的各种不同的热出口（38）位置之间的热传递路径 （14），其可以安装在电信装置（12）内。

公开(公告)号：WO2013054327A3

公开(公告)日：2013-06-06

申请号：PCT/IL2012050388

申请日：2012-09-24

Applicant: ELTA SYSTEMS LTD

Inventor： MOYAL DAVID ,  ELBAZ HAVIV

IPC: H05K7/20

CPC classification number: H05K7/20545

Abstract: A heat sink device configured for conduction cooling of at least one heat generating component that is mounted to a first face of a substrate is disclosed. The heat sink device includes a heat transfer body configured for being mounted with respect to the substrate and at least one heat transfer unit that includes a heat transfer element configured for providing a heat transfer path between the heat generating component and the heat transfer body. The heat transfer unit includes a first thermal contact surface configured for providing thermal contact between the heat transfer unit and the heat generating component in operation of the heat sink device. The heat transfer element includes a second thermal contact surface different the first thermal contact surface and in thermal communication with the first thermal contact surface. The heat transfer element is movably mounted with respect to the heat transfer body for selective displacement in at least a first direction with respect to the heat transfer body while concurrently providing thermal contact between the second thermal contact surface and the heat transfer body. Also disclosed are a corresponding conduction cooled module and a corresponding method for assembling a conduction cooled module.

Abstract translation: 公开了一种配置用于传导冷却至少一个安装在基板的第一面上的发热部件的散热装置。 散热装置包括被配置为相对于基板安装的传热体和至少一个传热单元，该传热单元包括被配置为在发热部件和传热体之间提供传热路径的传热元件。 传热单元包括第一热接触表面，其被配置为在散热器设备的操作中在传热单元和发热部件之间提供热接触。 传热元件包括不同于第一热接触表面并与第一热接触表面热连通的第二热接触表面。 传热元件相对于传热体可移动地安装，用于相对于传热体在至少第一方向上的选择性位移，同时在第二热接触表面和传热体之间提供热接触。 还公开了相应的传导冷却模块和用于组装传导冷却模块的相应方法。

公开(公告)号：WO2013054327A2

公开(公告)日：2013-04-18

申请号：PCT/IL2012/050388

申请日：2012-09-24

Applicant: ELTA SYSTEMS LTD.

Inventor： MOYAL, David ,  ELBAZ, Haviv

IPC: H05K7/20

CPC classification number: H05K7/20545

Abstract: A heat sink device configured for conduction cooling of at least one heat generating component that is mounted to a first face of a substrate is disclosed. The heat sink device includes a heat transfer body configured for being mounted with respect to the substrate and at least one heat transfer unit that includes a heat transfer element configured for providing a heat transfer path between the heat generating component and the heat transfer body. The heat transfer unit includes a first thermal contact surface configured for providing thermal contact between the heat transfer unit and the heat generating component in operation of the heat sink device. The heat transfer element includes a second thermal contact surface different the first thermal contact surface and in thermal communication with the first thermal contact surface. The heat transfer element is movably mounted with respect to the heat transfer body for selective displacement in at least a first direction with respect to the heat transfer body while concurrently providing thermal contact between the second thermal contact surface and the heat transfer body. Also disclosed are a corresponding conduction cooled module and a corresponding method for assembling a conduction cooled module.

Abstract translation: 公开了一种散热器装置，其被配置用于传导冷却安装到基板的第一面的至少一个发热部件。 散热装置包括构造成相对于基板安装的传热体和包括传热元件的至少一个传热单元，传热元件构造成用于在发热部件和传热体之间提供传热路径。 传热单元包括第一热接触表面，该第一热接触表面被配置为在散热器装置的操作中提供传热单元与发热部件之间的热接触。 传热元件包括与第一热接触表面不同且与第一热接触表面热连通的第二热接触表面。 传热元件相对于传热体可移动地安装，用于相对于传热体在至少第一方向上选择性移位，同时在第二热接触面和传热体之间提供热接触。 还公开了相应的传导冷却模块和用于组装传导冷却模块的相应方法。

公开(公告)号：WO2011133777A1

公开(公告)日：2011-10-27

申请号：PCT/US2011/033438

申请日：2011-04-21

Applicant: GE INTELLIGENT PLATFORMS EMBEDDED SYSTEMS, INC. ,  SPORER, Bernd ,  IRELAND, Robert

Inventor： SPORER, Bernd ,  IRELAND, Robert

IPC: H05K7/14 ,  H05K7/20

CPC classification number: H05K7/20545 ,  H05K7/1404 ,  Y10T29/49124

Abstract: A wedge lock for use with a single board computer includes a cooling plate positioned with respect to a printed circuit board (PCB), a clamp device configured to secure the single board computer in an operating environment, and a heat conductance plate positioned along a top surface of the cooling plate and a top surface of the clamp device to facilitate conduction cooling of the PCB.

Abstract translation: 与单板计算机一起使用的楔形锁包括相对于印刷电路板（PCB）定位的冷却板，构造成将单板计算机固定在操作环境中的夹紧装置，以及沿顶部定位的导热板 冷却板的表面和夹紧装置的顶表面，以便于PCB的传导冷却。

公开(公告)号：WO2011090920A1

公开(公告)日：2011-07-28

申请号：PCT/US2011/021492

申请日：2011-01-18

Applicant: WAVETHERM CORPORATION ,  MOSIER, David ,  BAME, Rodney

Inventor： MOSIER, David ,  BAME, Rodney

IPC: H05K7/14

CPC classification number: F16B2/14 ,  F16B41/002 ,  H05K7/1404 ,  H05K7/20545 ,  Y10T403/76

Abstract: A locking retainer for retaining an electronic module or printed circuit card in slots of a chassis. The retainer includes at least three wedge members movably linked to each other and disposed in longitudinal sequence along a longitudinal axis. The retainer can be made relatively smaller in height by moving the wedge members longitudinally such that a longitudinal distance between a first wedge member and a last wedge member of the sequence becomes smaller without the wedge members being longitudinally displaced along a common internal longitudinal element. All portions of the locking retainer that the middle wedge member is longitudinally moveable relative to do not extend through a theoretical plane disposed at a longitudinal midpoint of the middle wedge member and oriented normal to the longitudinal axis. The elimination of a central rail permits the wedge segments to have much greater contact area for greater thermal energy flow.

Abstract translation: 用于将电子模块或印刷电路卡保持在底盘的槽中的锁定保持器。 保持器包括至少三个楔形构件，其可移动地彼此连接并且沿着纵向轴线纵向地设置。 可以通过纵向移动楔形构件使保持器相对较小，使得第一楔形构件和序列的最后一个楔形构件之间的纵向距离变小，而楔形构件沿着共同的内部纵向元件纵向移位。 锁定保持器的所有部分，中间楔形构件相对于纵向不能延伸通过设置在中间楔形构件的纵向中点处的理论平面并垂直于纵向轴线定向。 消除中心轨道允许楔形部分具有更大的接触面积以获得更大的热能流动。

公开(公告)号：WO2011031670A2

公开(公告)日：2011-03-17

申请号：PCT/US2010/047984

申请日：2010-09-07

Applicant: HYBRICON CORPORATION ,  SULLIVAN, Robert C. ,  PALIS, Michael R. ,  PELLECCHIA, Ryan

Inventor： SULLIVAN, Robert C. ,  PALIS, Michael R. ,  PELLECCHIA, Ryan

IPC: H05K7/20

CPC classification number: H05K7/20127 ,  H05K7/1404 ,  H05K7/20545 ,  H05K7/20709

Abstract: A conduction-cooled enclosure comprises a card guide having a card guide channel, at least one controlled-volume cavity in the card guide channel, and a thermal interface material (TIM) in the at least one controlled-volume cavity.

Abstract translation: 传导冷却的外壳包括具有卡引导通道，卡引导通道中的至少一个受控体积空腔和至少一个受控体积空腔中的热界面材料（TIM）的卡引导件。

公开(公告)号：WO2010147711A1

公开(公告)日：2010-12-23

申请号：PCT/US2010/034008

申请日：2010-05-07

Applicant: GENERAL ELECTRIC COMPANY ,  VANDER PLOEG, Benjamin, Jon ,  STEENWYK, Meredith, Marie ,  COXON, Danny, Weldon ,  HORTON, Paul, James ,  STREYLE, John, Jay

Inventor： VANDER PLOEG, Benjamin, Jon ,  STEENWYK, Meredith, Marie ,  COXON, Danny, Weldon ,  HORTON, Paul, James ,  STREYLE, John, Jay

IPC: H05K9/00 ,  B64D45/02 ,  H02G13/00

CPC classification number: H05K9/0045 ,  H02G13/00 ,  H05K7/20545 ,  H05K9/0062 ,  H05K9/0084 ,  H05K2201/10371

Abstract: An avionics chassis comprises a composite housing, a radio wave shield, and a lightning strike conductive e path, wherein the radio wave e shield attenuates electronic interference entering and leaving, the housing, and the lightning strike conductive path directs the current from a lightning strike away from an inventor of the housing.

Abstract translation: 航空电子底盘包括复合外壳，无线电波屏蔽和雷击导电电路，其中无线电波e屏蔽衰减进入和离开的电子干扰，外壳和雷击导电路径引导电流从雷击 远离房屋的发明家。

公开(公告)号：WO2010045707A1

公开(公告)日：2010-04-29

申请号：PCT/CA2009/001059

申请日：2009-07-29

Applicant: NEX FLOW AIR PRODUCTS CORP. ,  BAKOS, Lou

Inventor： BAKOS, Lou

IPC: F25B9/04 ,  H05K7/20

CPC classification number: F25B9/04 ,  H05K7/20127 ,  H05K7/20545

Abstract: An apparatus for cooling an enclosure provided. The enclosure has at least one opening for receiving cool air and discharging heated air. The apparatus includes a vortex tube with a first end for discharging warm air and a second end for discharging cool air. The apparatus further includes an inlet between the ends of the vortex tube for directing compressed air tangentially into the interior of the vortex tube. A first housing covers the first end of the vortex tube and creates a space through which warm air is channelled to the exterior. The vortex tube is connected by an attachment to the opening of the enclosure so that the vortex tube can discharge cool air into the interior of the enclosure. The apparatus further includes an air outlet conduit at an end of the attachment to facilitate discharge of heated air for the enclosure. Also, the apparatus includes at least one barrier that permits the outflow of warm air from the first housing and heated air from the air outlet conduit while blocking the inflow of moisture and other substances.

Abstract translation: 一种用于冷却外壳的设备。 外壳具有至少一个用于接收冷空气并排出加热空气的开口。 该装置包括具有用于排出暖空气的第一端的涡流管和用于排出冷空气的第二端。 该装置还包括在涡流管的端部之间的入口，用于将压缩空气切向地导入涡流管的内部。 第一壳体覆盖涡流管的第一端并且产生空气，暖空气通过该空间被引导到外部。 涡流管通过附件连接到外壳的开口，使得涡流管可以将冷空气排放到外壳的内部。 该装置还包括在附件的端部处的空气出口导管，以便于排出用于外壳的加热的空气。 此外，该装置还包括至少一个障碍物，其允许来自第一壳体的暖空气和来自空气出口导管的加热空气流出，同时阻止湿气和其它物质的流入。

公开(公告)号：WO1996041510A1

公开(公告)日：1996-12-19

申请号：PCT/US1995007339

申请日：1995-06-07

Applicant: SMITHS INDUSTRIES AEROSPACE & DEFENSE SYSTEMS, INC. ,  BUJTAS, Geza ,  HUPP, Robert, A.

Inventor： SMITHS INDUSTRIES AEROSPACE & DEFENSE SYSTEMS, INC.

IPC: H05K07/20

CPC classification number: H05K7/1461 ,  H05K7/20545

Abstract: The invention centers around a circuit board assembly (12) having a heat sink (30) with a buss bar (20) integrally formed therein. Preferably, the heat sink (30) is provided between two parallel, opposed circuit boards (14, 16). The buss bar (20) is provided between the two circuit boards and is in electrical contact with circuit modules (18) provided on both of the circuit boards (14, 16). The heat sink (30) effectively conveys heat away from the circuit board assembly (12) generated by current flowing through the several circuit modules (18) provided on the circuit boards (14, 16). Preferably, the buss bar (20) is electrically insulated from both the circuit boards (14, 16) and the heat sink (30) but electrically connected to the circuit modules (18) provided on the surfaces of the circuit boards (14, 16) by terminals (56, 58) protruding from the opposed surfaces of the buss bar (20).

Abstract translation: 本发明围绕具有散热器（30）的电路板组件（12），其中整体形成有总线（20）。 优选地，散热器（30）设置在两个平行的相对的电路板（14,16）之间。 汇流条（20）设置在两个电路板之间，并且与设置在两个电路板（14,16）上的电路模块（18）电接触。 散热器（30）有效地将热量从电流板组件（12）传递出来，电流通过设置在电路板（14,16）上的几个电路模块（18）流过。 优选地，汇流条（20）与电路板（14,16）和散热器（30）电绝缘，但电连接到设置在电路板（14,16）的表面上的电路模块（18） ）通过从母线（20）的相对表面突出的端子（56,58）。

公开(公告)号：WO2016193162A1

公开(公告)日：2016-12-08

申请号：PCT/EP2016/062048

申请日：2016-05-27

Applicant: THALES

Inventor： PREDON, Eric ,  BELEC, Pierre

IPC: H05K7/20

CPC classification number: H05K1/144 ,  H05K1/0203 ,  H05K3/22 ,  H05K7/20545

Abstract: Carte électronique (1) comprenant un assemblage d'un circuit imprimé (2) comprenant une première face (4) recevant au moins un composant électronique, et d'un dissipateur thermique (3), le circuit imprimé (2) et le dissipateur thermique (3) étant empilés selon une direction d'empilement (z), ledit dissipateur thermique (3) étant fixé au circuit imprimé sur une deuxième face (6) opposée à la première face (4), ledit dissipateur thermique (3) comprenant une semelle (8), présentant la forme d'une plaque, et des reliefs (7) dépassant d'une surface plane (8a) de ladite semelle (8), les reliefs (7) étant destinés à augmenter la surface de contact entre le dissipateur thermique (3) et un flux d'air par rapport à la surface de contact entre la semelle (8) et le flux d'air, la semelle (8) étant interposée entre le circuit imprimé (2) et les reliefs (7) selon la direction d'empilement (z), le dissipateur thermique (3) étant fixé directement au circuit imprimé (2) par collage uniquement et en ce que ledit dissipateur thermique (3) est monobloc.

Abstract translation: 本发明涉及包括印刷电路板（2）的组件的电子板（1），该印刷电路板（2）包括容纳至少一个电子部件的第一表面（4）和散热器（3），印刷电路板 ）和所述散热器（3）沿堆叠方向（z）堆叠，所述散热器（3）在与所述第一表面（4）相对的第二表面（6）上附接到所述印刷电路板，所述散热器 3）包括板形的凸缘（8）和突出超过所述凸缘（8）的平坦表面（8a）的凸起图案（7），所述凸起图案（7）用于增加所述凸缘 散热器（3）和相对于凸缘（8）和空气流之间的接触表面的空气流，凸缘（8）插入在印刷电路板（2）和凸起图案（7）之间的堆叠 方向（z），散热器（3）通过粘附直接附接到印刷电路板（2），并且所述散热器（3） ）在一块。