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公开(公告)号：WO2023034273A1
公开(公告)日：2023-03-09
申请号：PCT/US2022/042000
申请日：2022-08-30
Applicant: ENTEGRIS, INC.
Inventor： PYDI, Chiranjeevi , RICHARD, Nathan , DONNELL, Steven , MERCHEL, Sara , MINSKY, Caleb , MUNOZ, Cerel , LIU, Yan
IPC: B23Q3/154 , H01L21/683
Abstract: Described are techniques and equipment (apparatus) for processing an electrostatic chuck at controlled process conditions, including, as an example, for processing an electrostatic chuck during a step of curing an adhesive that forms a bond between two layers of the electrostatic chuck.
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