Abstract:
In an electrical connector, cross talk between signal contacts in adjacent linear columns and rows may be reduced by changing the size of the lead portions of the contacts extending within a leadframe housing. For example, the height of the ground contact lead portions may be increased to further isolate signal contacts in adjacent columns from interfering electrical fields. The height of the signal contact lead portions may be decreased in order to accommodate the larger ground contact lead portions without increasing the overall size of the connector. Smaller signal contact lead portions may reduce the overall length differential between signal contacts in a differential pair, thereby minimizing signal skew.
Abstract:
An electrical connector according to the invention includes a linear contact array of electrically conductive contacts and a lead frame into which the contacts at least partially extend. The contacts may be selectively designated as either ground or signal contacts such that, in a first designation, the contacts form at least one differential signal pair comprising a pair of signal contacts, and, in a second designation, the contacts form at least one single-ended signal conductor.
Abstract:
Embodiments of electrical connectors include substantially identical first and second halves. The first and second halves each include insert molded leadframe assemblies that comprise electrical conductors. Each electrical conductor of the first half engages a substantially identical electrical conductor of the second half when the first and second halves are mated.
Abstract:
Methods for designing SMT connector footprints are disclosed. A circuit board may have disposed thereon an arrangement of SMT pads and corresponding vias. The arrangement of vias may differ from the arrangement of SMT pads. The arrangement of SMT pads may differ from the arrangement of contacts in a connector the footprint is designed to receive. The terminal ends of the contacts may be jogged or bent for electrical connection with the SMT pads. The SMT pads and vias may be arranged in a number of ways that increase signal contact density of the board, while limiting cross-talk and providing adequate impedance and routing space on the board. An interactive tool for designing such a footprint is disclosed.
Abstract:
A contact assembly (80) for use in an electrical connector. The contact assembly (80) includes an insulative contact block (81) defining a plurality of apertures (82) therethrough. The contacts assembly (80) also includes a plurality of dual beam contact terminals (80A). Each plurality of dual beam contact terminals (80A) extends through an aperture (82) in the contact block (81) wherein the dual beam contact terminals (80A) are seated within the aperture (82) of the contact block (81) at an inwardly directed tension that maintains a desired spring rate on the contacts.
Abstract:
A flexible flat connector cable electrical contact including a first connection section adapted to be connected to an electrical conductor of a flexible flat conductor (FFC) cable; and a second connection section electrical coupled to the first connection section and adapted to be electrically connected to another member. The first connection section includes at least one staple feature having a hole and only two outwardly extending lances at the hole. Each lance has a pointed tip adapted to pierce through the electrical conductor of the FFC cable. The lances are adapted to be deformed back towards the electrical conductor to form a stapled connection of the first connection section to the FFC cable with only the two lances at the staple feature.
Abstract:
Methods for designing SMT connector footprints are disclosed. A circuit board may have disposed thereon an arrangement of SMT pads and corresponding vias. The arrangement of vias may differ from the arrangement of SMT pads. The arrangement of SMT pads may differ from the arrangement of contacts in a connector the footprint is designed to receive. The terminal ends of the contacts may be jogged or bent for electrical connection with the SMT pads. The SMT pads and vias may be arranged in a number of ways that increase signal contact density of the board, while limiting cross-talk and providing adequate impedance and routing space on the board. An interactive tool for designing such a footprint is disclosed.
Abstract:
A preferred embodiment of a modular electrical connector (10) includes a plug (12) having a printed circuit board (20), a contact finger (32) positioned on a portion of the printed circuit board (20), and a housing (22) for supporting and constraining the printed circuit board 920) so that the portion of the printed circuit board (20) extends from the housing. The printed circuit board (20) has a flexible portion that permits the portion of the printed circuit board (20) to translate in relation to the housing (22). The modular electrical connector (10) also includes a receptacle (14) for mating with the plug (12) and having a first contact (66) for electrically contacting the contact finger (32) when the plug (12) and the receptacle (14) are mated, and a housing (52) having a slot (76) formed therein for receiving the portion of the printed circuit board (20) when the plug (12) and the receptacle (14) are mated.