公开(公告)号：WO2018134411A1

公开(公告)日：2018-07-26

申请号：PCT/EP2018/051475

申请日：2018-01-22

Applicant: FRANCISCO ALBERO S.A.U.

Inventor： MEDINA RODRÍGUEZ, Beatriz ,  BLANES GUÀRDIA, Mireia ,  RAMOS PÉREZ, Francisco Manuel

IPC: C09D11/033 ,  C09D11/037 ,  C09D11/106 ,  C09D11/52

CPC classification number: C09D11/106 ,  C09D11/033 ,  C09D11/037 ,  C09D11/52

Abstract: The present invention relates to a stretchable conducive ink suitable for printing electric circuits on a stretchable, thermoformable and flexible substrates and textiles. The ink is water-based and comprises a conductive material, an EVA copolymer, a co-solvent, and a dispersing agent. It relates also to the use of such ink composition for manufacturing a conductive polymer thick film, to a process for manufacturing a conductive polymer thick film, to a conductive polymer thick film, to the use of such conductive polymer thick film for manufacturing an electric circuit, and to the electric circuit comprising the conductive polymer thick film.

公开(公告)号：WO2018215338A1

公开(公告)日：2018-11-29

申请号：PCT/EP2018/063086

申请日：2018-05-18

Applicant: FRANCISCO ALBERO, S.A.U.

Inventor： BAILO BOBI, Eduardo ,  MEDINA RODRÍGUEZ, Beatriz ,  BLANES GUÀRDIA, Mireia ,  RAMOS PÉREZ, Francisco Manuel

IPC: C23C18/18 ,  C09D11/52 ,  C23C18/16 ,  C23C18/20 ,  C23C18/30 ,  C23C18/40 ,  H05B3/34

CPC classification number: C23C18/1605 ,  C09D11/037 ,  C09D11/322 ,  C09D11/52 ,  C23C18/1608 ,  C23C18/1893 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/40 ,  C23C18/405 ,  H05B3/145 ,  H05B3/20 ,  H05B2203/013 ,  H05B2214/04

Abstract: A process for preparing a copper coated conductive carbon-based substrate The present invention relates to a process for preparing a copper coated conductive carbon-based substrate which comprises: (a) activating a conductive carbon-based substrate by: (a') rinsing a conductive carbon-based substrate with an acid; and (a'') depositing on the rinsed conductive carbon-based substrate obtained in step (a') one or more catalytic seeds having a diameter comprised in the range from 25 to 500 µm using a printing ink catalyst composition comprising metallic particles; and (b) depositing copper on the activated conductive carbon-based substrate obtained in step (a) by electroless plating, wherein the deposition process comprises immersing the activated conductive carbon-based substrate in a copper electroless plating composition; to copper coated carbon-based substrate obtainable by this process and an electric circuit containing it. It also relates to a printing ink catalyst composition comprising: metallic particles; a carbon-based material; and a solvent.