HIGH TEMPERATURE PHOTONIC STRUCTURE FOR TUNGSTEN FILAMENT
    1.
    发明申请
    HIGH TEMPERATURE PHOTONIC STRUCTURE FOR TUNGSTEN FILAMENT 审中-公开
    高温光纤结构的TUNGSTEN FILAMENT

    公开(公告)号:WO2008079564A3

    公开(公告)日:2008-11-13

    申请号:PCT/US2007085346

    申请日:2007-11-21

    Abstract: The invention is directed to a process for the creation of a photonic lattice on the surface of an emissive substrate (10) comprising first depositing a thin film metal layer on at least one surface of the substrate, the thin film metal comprising a metal having a melting point lower than the melting point of the substrate, then annealing the thin film metal layer and the substrate to create nano-particles on the substrate surface by dewetting, and anodizing or plasma etching the annealed thin film metal and substrate to create pores (18) in the nano-particles and the substrate such that upon exposure to high temperature the emissivity of the substrate is refocused to generate emissions in the visible and lower infrared region and to substantially eliminate higher infrared emission, and to the substrate thus created.

    Abstract translation: 本发明涉及一种用于在发光衬底(10)的表面上产生光子晶格的方法,包括首先在衬底的至少一个表面上沉积薄膜金属层,所述薄膜金属包括具有 熔点低于衬底的熔点,然后使薄膜金属层和衬底退火,通过去湿和阳极氧化或等离子体蚀刻退火的薄膜金属和衬底以产生孔(18),从而在衬底表面上产生纳米颗粒 ),使得在暴露于高温时,衬底的发射率被重新聚焦以在可见光和较低红外区域中产生发射并且基本上消除较高的红外发射,并且基本上消除了由此产生的衬底。

    FOIL CONNECTOR FOR A LAMP
    2.
    发明申请
    FOIL CONNECTOR FOR A LAMP 审中-公开
    灯管连接器

    公开(公告)号:WO2007133926A3

    公开(公告)日:2008-08-14

    申请号:PCT/US2007067788

    申请日:2007-04-30

    CPC classification number: H01J61/368 H01J9/28

    Abstract: A foil connector (28, 30) suited for use in a lamp (10) is provided. The foil connector includes a substrate layer (40) formed from an electrically conductive material. A coating (42) is provided for reducing oxidation of the substrate during lamp operation. The coating includes a first coating layer (44) on the substrate comprising a noble metal, a second coating layer (46) spaced from the substrate by the first coating layer, the second coating layer comprising a noble metal, and optionally, a third coating layer (48) spaced from the substrate by the first and second coating layers, the third coating layer comprising a noble metal.

    Abstract translation: 提供适用于灯(10)的箔连接器(28,30)。 箔连接器包括由导电材料形成的基底层(40)。 提供涂层(42),用于在灯操作期间减少衬底的氧化。 所述涂层包括在所述基材上的第一涂层(44),所述第一涂层包括贵金属,所述第二涂层(46)通过所述第一涂层与所述基板间隔开,所述第二涂层包含贵金属,以及任选地,第三涂层 层(48)通过第一和第二涂层与衬底间隔开,第三涂层包含贵金属。

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