公开(公告)号：WO2022231308A1

公开(公告)日：2022-11-03

申请号：PCT/KR2022/006034

申请日：2022-04-27

Applicant: GLOBALWAFERS CO., LTD.

Inventor： CHOI, Cheulwon ,  KIM, Jongsun ,  KWEON, Hyoshik ,  LEE, Jaehoon ,  LEE, Byungchul ,  LEE, Minkyu

IPC: B24B37/08 ,  B24B37/24 ,  B24D3/10 ,  B24D18/00 ,  H01L21/67

Abstract: Methods and apparatus for simultaneous double-side grinding semiconductor structures are disclosed. The double-side grinding apparatus may include first and second grinding wheels each having abrasive members that are shaped as a convex polygon (e.g., convex pentagon).