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    ANODIZED LAYER AND ALUMINUM LAYER OVER SUBSTRATE
    1.
    发明申请
    ANODIZED LAYER AND ALUMINUM LAYER OVER SUBSTRATE 审中-公开
    基板上的阳极化层和铝层

    公开(公告)号：WO2016175860A1

    公开(公告)日：2016-11-03

    申请号：PCT/US2015/028643

    申请日：2015-04-30

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P

    Inventor： WU, Kuan-Ting ,  KASHYAP, Chalam ,  CHANG, James

    IPC: C23C28/00 ,  C23C4/06 ,  C23C16/02 ,  C25D11/02

    CPC classification number: C23C24/106 ,  C23C28/023 ,  C25D11/04

    Abstract: Various examples described herein provide for a substrate, or a method for preparing a substrate, including an aluminum layer and an anodized layer over a substrate. For instance, the substrate may comprise a substrate, a continuous aluminum layer formed over the substrate, and an anodized layer formed over the continuous aluminum layer.

    Abstract translation: 本文描述的各种实例提供了一种衬底或用于制备衬底的方法，其包括在衬底上的铝层和阳极氧化层。 例如，衬底可以包括衬底，在衬底上形成的连续铝层，以及形成在连续铝层上的阳极氧化层。

    OXIDIED AND COATED ARTICLES AND METHODS OF MAKING SAME
    2.
    发明申请
    OXIDIED AND COATED ARTICLES AND METHODS OF MAKING SAME 审中-公开
    氧化和涂层制品及其制备方法

    公开(公告)号：WO2016122467A1

    公开(公告)日：2016-08-04

    申请号：PCT/US2015/013174

    申请日：2015-01-28

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： KASHYAP, Chalam ,  WU, Kuan-Ting

    IPC: H05K5/02 ,  C23C14/08

    CPC classification number: H05K5/04 ,  C23C28/00 ,  C23C28/345 ,  C25D11/026 ,  C25D11/04 ,  C25D11/18 ,  C25D11/26 ,  C25D11/30 ,  C25D11/34 ,  C25D13/12 ,  C25D13/20

    Abstract: One example provides a method of manufacturing. The method comprises oxidizing, using plasma, a first surface of a substrate comprising a metal-material. The method further comprises cutting into the substrate through the oxidized first surface to expose a non-oxidized second surface of the substrate, the second surface not parallel to the first surface. The method further comprises disposing, using electrophoretic deposition, a coating layer over the exposed second surface to form an article having the oxidized first surface and the coated second surface.

    Abstract translation: 一个例子提供了一种制造方法。 该方法包括使用等离子体氧化包含金属材料的基底的第一表面。 该方法还包括通过氧化的第一表面切割到基底中以暴露基底的未氧化的第二表面，第二表面不平行于第一表面。 该方法还包括使用电泳沉积在暴露的第二表面上设置涂层以形成具有氧化的第一表面和涂覆的第二表面的制品。

    HOUSINGS FOR ELECTRONIC DEVICES
    3.
    发明申请
    HOUSINGS FOR ELECTRONIC DEVICES 审中-公开

    公开(公告)号：WO2020145953A1

    公开(公告)日：2020-07-16

    申请号：PCT/US2019/012808

    申请日：2019-01-09

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： WU, Kuan-Ting ,  KASHYAP, Chalam ,  CHANG, Chi-Hao

    IPC: C23C28/00 ,  B32B15/00 ,  H05K5/04 ,  B32B33/00

    Abstract: A housing for an electronic device is described. The housing comprises a substrate, which comprises a magnesium alloy. The substrate has a first coated surface and a second coated surface. The first coated surface comprises an oxidized layer or at least one coating layer. The second coated surface comprises a layer coated on a non-oxidized surface of the substrate. The layer comprises (i) a chelating agent and a metal ion or a chelated metal complex thereof, or (ii) a sol-gel coating or a sol-gel hybrid coating.

    COATED SUBSTRATES FOR ELECTRONIC DEVICES
    8.
    发明申请
    COATED SUBSTRATES FOR ELECTRONIC DEVICES 审中-公开

    公开(公告)号：WO2020046324A1

    公开(公告)日：2020-03-05

    申请号：PCT/US2018/048779

    申请日：2018-08-30

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： WU, Kuan-Ting ,  CHANG, Chi-Hao ,  KASHYAP, Chalam

    IPC: B32B15/04 ,  C23C28/00 ,  B32B27/04 ,  B32B27/06 ,  H05K5/00

    Abstract: The present disclosure is drawn to a coated substrate for an electronic device, and can include a substrate for housing or support electronic components, a primer layer on the substrate, and a ceramo-metallic layer on the primer layer. The ceramo-metallic layer can include a composite of ceramic particles in an amount of about 3 wt% to about 15 wt%, reflective metal particles in an amount of about 0.1 wt% to about 2 wt%, and polymer binder in an amount of about 70 wt% to about 97 wt%, with the ceramo-metallic layer weight percentages based on dry weight.

    MAGNESIUM ALLOY SUBSTRATE
    10.
    发明申请
    MAGNESIUM ALLOY SUBSTRATE 审中-公开
    镁合金基板

    公开(公告)号：WO2016068838A1

    公开(公告)日：2016-05-06

    申请号：PCT/US2014/062369

    申请日：2014-10-27

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： KASHYAP, Chalam ,  WU, Kuan-Ting

    IPC: C23C28/00 ,  C25D11/30

    CPC classification number: C25D13/12 ,  C25D5/42 ,  C25D7/00 ,  C25D11/30 ,  C25D13/02

    Abstract: According to one example, preparing a substrate for an electronic device can include forming a deposition layer on a magnesium alloy substrate, anodizing the magnesium alloy substrate, and forming an electrophoretic deposition layer on the anodized magnesium alloy substrate.

    Abstract translation: 根据一个示例，制备电子器件用基板可以包括在镁合金基板上形成沉积层，阳极氧化镁合金基板，以及在阳极氧化的镁合金基板上形成电泳沉积层。

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