公开(公告)号：WO2018125452A1

公开(公告)日：2018-07-05

申请号：PCT/US2017063328

申请日：2017-11-27

Applicant: INTEL CORP

Inventor： CHANG JE-YOUNG ,  SAHASRABUDHE SHUBHADA H ,  HARIRCHIAN TANNAZ

IPC: H01L23/482 ,  H01L23/13 ,  H01L23/485 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L21/481 ,  H01L21/4846 ,  H01L23/04 ,  H01L23/16 ,  H01L23/3675 ,  H01L23/49822 ,  H01L23/49838 ,  H01L25/0655

Abstract: Semiconductor packages having support members are provided. Support members can mitigate damage to a semiconductor die mounted on a semiconductor package. In some embodiments, an arrangement of support packages can be formed at respective locations of a frame layer that serves as a stiffener for the semiconductor package. Each support member in the arrangement can be formed from a same material of the frame layer or a different material. In some embodiments, a support member can be mounted or otherwise coupled to an exposed surface of the frame layer. In addition or in other embodiments, a support member can be mounted on a surface that supports the semiconductor die. The arrangement of support members can include support members comprising a first material and/or other support members formed from respective materials. A support member can be formed from a metal, a metal alloy, a semiconductor, a polymer, a composite material, or a porous material.