公开(公告)号：WO2017112255A1

公开(公告)日：2017-06-29

申请号：PCT/US2016/063333

申请日：2016-11-22

Applicant: INTEL CORPORATION

Inventor： TRAN, Donald T. ,  MURTAGIAN, Gregorio ,  LIU, Kuang ,  NEKKANTY, Srikant ,  MOHAMMAD, Feroz ,  MEYYAPPAN, Karumbu ,  XIE, Hong ,  AOKI, Russell S. ,  CHAWLA, Gaurav

IPC: H01R13/62 ,  H01R13/639 ,  H01R12/71

CPC classification number: H01R4/5066 ,  H01R4/5008 ,  H01R4/52 ,  H01R12/721 ,  H01R12/85 ,  H01R13/508 ,  H01R13/639

Abstract: An apparatus comprises a cable connector including: a first connector body portion including a first plurality of electrical contacts arranged to contact electrical contacts of a first surface of an edge connector substrate; a second connector body portion separate from the first connector body portion and including a second plurality of electrical contacts arranged to oppose the first plurality of electrical contacts of the first connector body portion and to contact electrical contacts of a second surface of the edge connector substrate, wherein the first and second plurality of electrical contacts are electrically coupled to one or more cables; and a joining mechanism configured to join the first connector body portion and the second connector body portion together and to apply a bias force to the edge connector substrate when the edge connector substrate is arranged between the first connector body portion and the second connector body portion.

Abstract translation: 一种设备包括电缆连接器，该电缆连接器包括：第一连接器主体部分，其包括布置成接触边缘连接器基板的第一表面的电触点的第一多个电触点; 第二连接器主体部分，其与第一连接器主体部分分开并且包括第二多个电触点，所述第二多个电触点布置成与第一连接器主体部分的第一多个电触点相对并且接触边缘连接器基板的第二表面的电触点， 其中所述第一和第二多个电触点电耦合到一个或多个电缆; 以及接合机构，所述接合机构被构造成将所述第一连接器主体部分和所述第二连接器主体部分接合在一起，并且当所述边缘连接器基板布置在所述第一连接器主体部分和所述第二连接器主体部分之间时，

公开(公告)号：WO2019190632A1

公开(公告)日：2019-10-03

申请号：PCT/US2019/016864

申请日：2019-02-06

Applicant: INTEL CORPORATION

Inventor： MOHAMMAD, Feroz ,  ARAVAMUDHAN, Srinivasa

IPC: H05K3/34

Abstract: An electronic device that includes a first electronic component with a pin element and a second electronic component with a solder element. A joint is formed that provides an electrical and mechanical connection between the first electronic component and second electronic component when the pin element is heated, inserted into the solder element, and cooled.