公开(公告)号：WO2013184921A3

公开(公告)日：2013-12-12

申请号：PCT/US2013/044519

申请日：2013-06-06

Applicant: INVENSAS CORPORATION

Inventor： UZOH, Cyprian Emeka ,  WOYCHIK, Charles G. ,  CASKEY, Terrence ,  DESAI, Kishor V. ,  WEI, Huailiang ,  MITCHELL, Craig ,  HABA, Belgacem

IPC: H01L21/768 ,  H01L23/48 ,  H01L23/00

Abstract: A component 10 can include a substrate 20 and a conductive via 40 extending within an opening 30. The substrate 20 can have first and second opposing surfaces 21, 22. A dielectric material 60 can be exposed at an inner wall 32 of the opening 30. The conductive via 40 can define a relief channel 55 within the opening 30 adjacent the first surface 21. The relief channel 55 can have an edge 56 within a first distance D1 from the inner wall 32 in a direction D2 of a plane P parallel to and within five microns below the first surface 21, the first distance being the lesser of one micron and five percent of a maximum width of the opening 30 in the plane. The edge 56 can extend along the inner wall 32 to span at least five percent of a circumference of the inner wall.