公开(公告)号：WO2021188364A1

公开(公告)日：2021-09-23

申请号：PCT/US2021/022030

申请日：2021-03-12

Applicant: KLA CORPORATION

Inventor： MANTIPLY, Bryant ,  LIU, Xiumei ,  GIUSTI, Matthew ,  CAO, Kai ,  WALLINGFORD, Richard

IPC: G01N21/88 ,  G01N21/95 ,  G01B11/02 ,  G02B7/28 ,  H01L21/66

Abstract: Methods and systems for determining focus settings for use in a specimen scan are provided. One method includes generating a focus map defined as values of best focus as a function of position on a specimen using output generated in one or more pre-focus swaths scanned on the specimen by an output acquisition subsystem configured to direct energy to a specimen, to detect energy from the specimen, and to generate output responsive to the detected energy. The method also includes interpolating the focus map to generate focus settings for a scan performed on the specimen during a process and storing information for the generated focus settings for use in the scan performed on the specimen during the process.

公开(公告)号：WO2020081476A1

公开(公告)日：2020-04-23

申请号：PCT/US2019/056168

申请日：2019-10-15

Applicant: KLA CORPORATION

Inventor： DOWLING, David ,  SINGH, Tarunark ,  BRAUER, Bjorn ,  BHATTACHARYYA, Santosh ,  MANTIPLY, Bryant ,  LEE, Hucheng ,  LI, Xiaochun ,  PARK, Sean Sangbong

IPC: H01L21/66 ,  H01L21/67 ,  G06T7/00

Abstract: A method of semiconductor-wafer image alignment is performed at a semiconductor-wafer defect-inspection system. In the method, a semiconductor wafer is loaded into the semiconductor-wafer defect-inspection system. Pre-inspection alignment is performed for the semiconductor wafer. After performing the pre-inspection alignment, a first swath is executed to generate a first image of a first region on the semiconductor wafer. An offset of a target structure in the first image with respect to a known point is determined. Defect identification is performed for the first image, using the offset. After executing the first swath and determining the offset, a second swath is executed to generate a second image of a second region on the semiconductor wafer. While executing the second swath, run-time alignment of the semiconductor wafer is performed using the offset.