公开(公告)号：WO2019032252A1

公开(公告)日：2019-02-14

申请号：PCT/US2018/042635

申请日：2018-07-18

Applicant: LAM RESEARCH CORPORATION

Inventor： PANAGOPOULOS, Theodoros ,  GOULD, Richard ,  REYES, Edmundo ,  BONIFACE, John ,  BERRY, Ivan ,  DULKIN, Alexander ,  VAN SCHRAVENDIJK, Bart

IPC: H01L21/677 ,  H01L21/67

Abstract: An apparatus for transporting or storing at least one semiconductor wafer in an ultra-high vacuum is provided. A portable vacuum transfer pod is provided comprising an internal wafer storage chamber for storing one or more wafers and a wafer support for supporting at least one wafer within the internal wafer storage chamber. A passively capable vacuum pump capable of passive vacuum pumping is in fluid connection with the internal wafer storage chamber and is mechanically connected to the portable vacuum transfer pod. A shut off valve for opening and closing the fluid connection is between the passively capable vacuum pump and the internal wafer storage chamber.