公开(公告)号：WO2021030184A1

公开(公告)日：2021-02-18

申请号：PCT/US2020/045389

申请日：2020-08-07

Applicant: LAM RESEARCH CORPORATION

Inventor： MISHRA, Rohini ,  SRIRAMAN, Saravanapriyan

IPC: H01J37/32 ,  H01L21/687 ,  H01L21/205

Abstract: A substrate support includes an outer edge ring configured to be raised and lowered relative to the substrate support via one or more lift pins. The outer edge ring is further configured to interface with a guide feature extending upward from a middle ring of the substrate support. An inner edge ring is located radially inward of the outer edge ring and is configured to be raised and lowered, independently of the outer edge ring, relative to the substrate support via one or more lift pins.