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    MOVEABLE EDGE RINGS FOR SUBSTRATE PROCESSING SYSTEMS
    2.
    发明申请
    MOVEABLE EDGE RINGS FOR SUBSTRATE PROCESSING SYSTEMS 审中-公开

    公开(公告)号：WO2021030184A1

    公开(公告)日：2021-02-18

    申请号：PCT/US2020/045389

    申请日：2020-08-07

    Applicant: LAM RESEARCH CORPORATION

    Inventor： MISHRA, Rohini ,  SRIRAMAN, Saravanapriyan

    IPC: H01J37/32 ,  H01L21/687 ,  H01L21/205

    Abstract: A substrate support includes an outer edge ring configured to be raised and lowered relative to the substrate support via one or more lift pins. The outer edge ring is further configured to interface with a guide feature extending upward from a middle ring of the substrate support. An inner edge ring is located radially inward of the outer edge ring and is configured to be raised and lowered, independently of the outer edge ring, relative to the substrate support via one or more lift pins.

    PERFORMANCE PREDICTORS FOR SEMICONDUCTOR-MANUFACTURING PROCESSES
    3.
    发明申请
    PERFORMANCE PREDICTORS FOR SEMICONDUCTOR-MANUFACTURING PROCESSES 审中-公开

    公开(公告)号：WO2021154747A1

    公开(公告)日：2021-08-05

    申请号：PCT/US2021/015121

    申请日：2021-01-26

    Applicant: LAM RESEARCH CORPORATION

    Inventor： SAWLANI, Kapil Umesh ,  DANEK, Michal ,  VELLANKI, Ravi ,  GOPINATH, Sanjay ,  COHEN, David G. ,  ROHAM, Sassan ,  SRIRAMAN, Saravanapriyan ,  HASKELL, Benjamin Allen ,  BROGAN, Lee J.

    IPC: H01L21/66 ,  G05B15/02 ,  G05B17/02 ,  G06N20/00

    Abstract: Methods, systems, and computer programs are presented for predicting the performance of semiconductor manufacturing equipment operations. One method includes an operation for obtaining machine-learning (ML) models, each model related to predicting a performance metric for an operation of a semiconductor manufacturing tool. Further, each ML model utilizes features defining inputs for the ML model. The method further includes an operation for receiving a process definition for manufacturing a product with the semiconductor manufacturing tool. One or more ML models are utilized to estimate a performance of the process definition used in the semiconductor manufacturing tool. Additionally, the method includes presenting, on a display, results showing the estimate of the performance of the manufacturing of the product. In some aspects, the use of hybrid models improves the predictive accuracy of the system by augmenting the capabilities of data-driven models with the reinforcement provided by the physics-based models.

    SEMICONDUCTOR SUBSTRATE BEVEL CLEANING
    4.
    发明申请
    SEMICONDUCTOR SUBSTRATE BEVEL CLEANING 审中-公开

    公开(公告)号：WO2021071999A1

    公开(公告)日：2021-04-15

    申请号：PCT/US2020/054663

    申请日：2020-10-08

    Applicant: LAM RESEARCH CORPORATION

    Inventor： SRIRAMAN, Saravanapriyan

    IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687 ,  H01J37/32

    Abstract: A system for performing a bevel cleaning process on a substrate includes a substrate support including an electrode and a plurality of plasma needles arranged around a perimeter of the substrate support. The plasma needles are in fluid communication with a gas delivery system and are configured to supply reactive gases from the gas delivery system to a bevel region of the substrate when the substrate is arranged on the substrate support and electrically couple to the electrode of the substrate support and generate plasma around the bevel region of the substrate.

    RESIST AND ETCH MODELING
    6.
    发明申请
    RESIST AND ETCH MODELING 审中-公开

    公开(公告)号：WO2019199697A1

    公开(公告)日：2019-10-17

    申请号：PCT/US2019/026396

    申请日：2019-04-08

    Applicant: LAM RESEARCH CORPORATION

    Inventor： SRIRAMAN, Saravanapriyan ,  FRIED, David M.

    IPC: H01L21/3065 ,  H01L21/027 ,  H01L21/311 ,  G03F7/20 ,  G03F1/80

    Abstract: Computer implemented methods and computer program products have instructions for generating transfer functions that relate segments on lithography photomasks to features produced by photolithography and etching using such segments. Such methods may be characterized by the following elements: (a) receiving after development inspection metrology results produced from one or more first test substrates on which resist was applied and patterned using a set of design layout segments; (b) receiving after etch inspection metrology results produced from one or more second test substrates which were etched after resist was applied and patterned using said set of design layout segments; and (c) generating the transfer function using the set of design layout segments together with corresponding after development inspection metrology results and corresponding after etch inspection metrology results.

    MULTI-ZONE COOLING OF PLASMA HEATED WINDOW
    10.
    发明申请
    MULTI-ZONE COOLING OF PLASMA HEATED WINDOW 审中-公开

    公开(公告)号：WO2019099313A1

    公开(公告)日：2019-05-23

    申请号：PCT/US2018/060240

    申请日：2018-11-12

    Applicant: LAM RESEARCH CORPORATION

    Inventor： ZHANG, Yiting ,  MARSH, Richard ,  SRIRAMAN, Saravanapriyan ,  PATERSON, Alexander

    IPC: H01J37/32

    Abstract: A substrate processing system includes a multi-zone cooling apparatus to provide cooling for all or substantially all of a window in a substrate processing chamber. In one aspect, the apparatus includes one or more plenums to cover all or substantially all of a window in a substrate processing chamber, including under an energy source for transformer coupled plasma in the substrate processing chamber. One or more air amplifiers and accompanying conduits provide air to the one or more plenums to provide air flow to the window. The conduits are connected to plenum inlets at various distances from the center, to direct airflow throughout the window and thus address center hot, middle hot, and edge hot conditions, depending on the processes being carried out in the chamber. In one aspect, the one or more plenums include a central air inlet, to direct air toward the center portion of the window, to address center hot conditions.

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