IMPROVED METHODS OF CLEANING COPPER SURFACES IN THE MANUFACTURE OF PRINTED CIRCUIT BOARDS
    1.
    发明申请
    IMPROVED METHODS OF CLEANING COPPER SURFACES IN THE MANUFACTURE OF PRINTED CIRCUIT BOARDS 审中-公开
    印刷电路板制造中清洗铜表面的改进方法

    公开(公告)号:WO2005048663A3

    公开(公告)日:2005-09-22

    申请号:PCT/US2004031434

    申请日:2004-09-24

    CPC classification number: H05K3/383 C23F1/18 C23G1/103 H05K2203/0796

    Abstract: The present invention sets forth an improved method of microetching a metal substrate by contacting the substrate with an aqueous composition comprising a sodium persulfate or hydrogen peroxide oxidizing agent, acid, and one or more additives. When the oxidizing agent is sodium persulfate, the one or more additives generally comprise an aliphatic saturated dicarboxylic acid. When the oxidizing agent is hydrogen peroxide, the one or more additives generally comprise a stabilizer and amino tris(methylene phosphonic acid).

    Abstract translation: 本发明提出了通过使基材与包含过硫酸钠或过氧化氢氧化剂,酸和一种或多种添加剂的水性组合物接触来对金属基材进行微蚀刻的改进方法。 当氧化剂是过硫酸钠时,一种或多种添加剂通常包括脂肪族饱和二羧酸。 当氧化剂是过氧化氢时,一种或多种添加剂通常包含稳定剂和氨基三(亚甲基膦酸)。

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