公开(公告)号：WO2005051590A1

公开(公告)日：2005-06-09

申请号：PCT/CA2004/001992

申请日：2004-11-19

Applicant: MEMBRANE REACTOR TECHNOLOGIES LTD. ,  LI, Anwu

Inventor： LI, Anwu

IPC: B23K20/14

CPC classification number: B01D69/145 ,  B01D65/003 ,  B01D67/0055 ,  B01D71/022 ,  B23K20/02 ,  B23K20/22 ,  B23K2203/05 ,  B23K2203/08 ,  B23K2203/18 ,  C01B3/505 ,  C01B2203/041 ,  C01B2203/047 ,  C01B2203/0475 ,  C01B2203/048 ,  C01B2203/0495

Abstract: This invention relates to a method of bonding a metallic membrane with metallic part involving pressing a smooth surface of the metallic membrane against the smooth surface of the metallic part, and heating the metallic membrane and metallic part to a temperature above the half melting point of the metallic membrane while subjecting the metallic membrane and metallic part to a controlled environment of a proper gas atmosphere. The metallic membrane can comprise palladium and the pressurized gas can comprise one of hydrogen, an inert gas or their mixture.

Abstract translation: 本发明涉及一种将金属膜与金属部分接合的方法，包括将金属膜的光滑表面压在金属部件的光滑表面上，并将金属膜和金属部件加热至高于金属部件的半熔点 同时使金属膜和金属部件受到适当气体气氛的受控环境的影响。 金属膜可以包括钯，并且加压气体可以包括氢气，惰性气体或其混合物中的一种。