公开(公告)号：WO2004056161A1

公开(公告)日：2004-07-01

申请号：PCT/IB2003/005890

申请日：2003-12-12

Applicant: METALLIZED PRODUCTS INC

Inventor： WILHEIM, Martin, J. ,  ALOIS, Edward, J.

IPC: H05K3/00

CPC classification number: B32B27/08 ,  B29C63/0043 ,  B29C63/0056 ,  B32B7/06 ,  B32B15/08 ,  B32B15/20 ,  B32B27/36 ,  B32B37/00 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2310/025 ,  B32B2311/12 ,  B32B2457/08 ,  H05K3/022 ,  Y10T156/1994

Abstract: An improved method of an apparatus for producing novel preferably thin plastic protective or masking film layer products (2) for thin shiny copper foils (1) and the like, as for PCB applications and the like, with an inner releasable film surface coating (2’’) carrying a permanent electric-charge for adhering to the shiny foil surface (1’), but with the opposite outer surface (2’) of the film being maintained uncharged and electrically neutral.

Abstract translation: 一种用于制造用于薄发光铜箔（1）等的新型优选薄塑料保护或掩蔽膜层产品（2）的设备的改进方法，对于PCB应用等，具有内部可释放膜表面涂层（2 （1'），但是膜的相对的外表面（2'）保持不带电和电中性。

公开(公告)号：WO2004004429A1

公开(公告)日：2004-01-08

申请号：PCT/IB2002/004025

申请日：2002-09-30

Applicant: METALLIZED PRODUCTS INC.

Inventor： WILHEIM, Martin, J.

IPC: H05K3/00

CPC classification number: B32B15/08 ,  B29C63/0043 ,  B29C63/0056 ,  B29L2031/3425 ,  B32B7/06 ,  B32B27/36 ,  B32B37/00 ,  B32B2310/025 ,  B32B2311/12 ,  B32B2457/08 ,  H05K3/022 ,  Y10T29/49826 ,  Y10T156/1067 ,  Y10T428/31681 ,  Y10T428/31909

Abstract: An improved method of and apparatus for producing preferably thin plastic protective film layers (2) for thin shiny copper foils (1) and the like, as for PCB applications, with electric charge adhering of the same to the foil (1) and with peel-off releasable properties to provide the same original pristine, shiny copper foil surface without contamination, marring or other physical, chemical or other residue despite handling and other processing procedures.

Abstract translation: 一种用于生产优选薄的塑料保护膜层（2）的改进方法和设备，用于薄的发光铜箔（1）等，对于PCB应用，其电荷与箔（1）附着并且具有剥离 提供相同的原始原始光泽的铜箔表面，无污染，损坏或其他物理，化学或其他残留物，尽管处理和其他加工程序。