公开(公告)号：WO2020142241A1

公开(公告)日：2020-07-09

申请号：PCT/US2019/067609

申请日：2019-12-19

Applicant: MICRON TECHNOLOGY, INC.

Inventor： MARR, Kenneth William ,  CERAFOGLI, Chiara ,  PICCARDI, Michele ,  TIBURZI, Marco-Domenico ,  FREEMAN, Eric Higgins ,  TOMAYER, Joshua Daniel

IPC: G01L1/18 ,  G01L1/16 ,  H01L29/84

Abstract: A microelectronic chip device includes a semiconductor substrate and multiple on-chip strain sensors (OCSSs) constructed on the substrate at various locations of the substrate. The OCSSs may each include multiple piezoresistive devices configured to sense a strain at a location of the various locations and produce a strain signal representing the strain at that location. A strain measurement circuit may also be constructed on the semiconductor substrate and configured to measure strain parameters from the strain signals produced by the OCSSs. The strain parameters represent the strains at the various location. Values of the strain parameters can be used for analysis of mechanical stress on the chip device.

公开(公告)号：WO2020006060A1

公开(公告)日：2020-01-02

申请号：PCT/US2019/039210

申请日：2019-06-26

Applicant: MICRON TECHNOLOGY, INC.

Inventor： CERAFOGLI, Chiara ,  RORI, Fulvio ,  OH, Jonathan W ,  CARIELLO, Giuseppe

IPC: G11C16/10 ,  G11C29/02 ,  G11C16/22 ,  G11C16/34

Abstract: Devices and techniques for NAND temperature-aware operations are disclosed herein. A device controller can receive a command to write data to a component in the device. A temperature corresponding to the component can be obtained in response to receiving the command. The command can be executed by the controller to write data to the component. Executing the command can include writing the temperature into a management portion of the device that is separate from a user portion of the device to which the data is written.