公开(公告)号：WO2014210106A1

公开(公告)日：2014-12-31

申请号：PCT/US2014/044013

申请日：2014-06-25

Applicant: MOLEX INCORPORATED ,  WANHA, Christopher D.

Inventor： WANHA, Christopher D.

IPC: H05K7/20 ,  H01R24/38

CPC classification number: H05K7/205 ,  G06F1/183 ,  G06F1/20 ,  H01L23/3675 ,  H01L23/40 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20409 ,  H05K7/20436 ,  H05K7/20509 ,  H05K9/002 ,  H01L2924/00

Abstract: A thermal interposer for use in providing a mating interface between a heat sink and an electronic module includes an elongated body portion having two opposing surfaces. On one surface, a plurality of press-fit pegs are defined that extend upwardly and outwardly away from the interposer body portion. On the other, opposing surface, a plurality of contact arms are defined that extend, in cantilevered fashion, downwardly and away from the interposer body portion. The press-fit pins are configured to enter grooves formed in a heat sink in a manner to form intimate, metal to metal, contact while the contact arms are configured to contact the top surface of an electronic module with reliable normal force.

Abstract translation: 用于提供散热器和电子模块之间的配合接口的热插入件包括具有两个相对表面的细长主体部分。 在一个表面上，限定了多个压配合钉，其从中介体主体部分向上并向外延伸。 另一方面，相对表面限定了以悬臂方式向下并远离插入件主体部分延伸的多个接触臂。 压配合销构造成以形成紧密的金属对金属的方式进入形成在散热器中的凹槽，同时接触臂被配置为以可靠的法向力接触电子模块的顶表面。